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Fabrication of a shear stress sensor matrix using standard printed circuit board and overmoulding technologies

Ann Monté (UGent) , Jef Daems and Jeroen Missinne (UGent)
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Abstract
In contrast to pressure distributions that can nowadays easily be measured using commercial sensor sheets, this is not yet the case for frictional or shear stresses. Those stresses act parallel to a surface which makes it more challenging to develop suitable sensors. A number of shear sensor prototypes have been reported until now, but realizing a matrix of shear sensors remains a big challenge because of cost and complexity issues. Therefore, this paper presents a fabrication approach for realizing a matrix of shear sensors using standard PCB and moulding technologies. The presented sensor is based on changing the coupling of optical power between a Light Emitting Diode and a set of photodiodes in combination with an overmoulding step, as such realizing a mechanical transducer. To demonstrate the fabrication flow, a first demonstrator incorporating a 5-taxel sensor matrix has been realized, able to record the in-plane shear stress magnitude and direction.
Keywords
frictional force, LED, mirror, optoelectronic, photodiode, sensor matrix, shear stress sensor

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MLA
Monté, Ann, et al. “Fabrication of a Shear Stress Sensor Matrix Using Standard Printed Circuit Board and Overmoulding Technologies.” IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, vol. 10, no. 3, 2020, pp. 479–86.
APA
Monté, A., Daems, J., & Missinne, J. (2020). Fabrication of a shear stress sensor matrix using standard printed circuit board and overmoulding technologies. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 10(3), 479–486.
Chicago author-date
Monté, Ann, Jef Daems, and Jeroen Missinne. 2020. “Fabrication of a Shear Stress Sensor Matrix Using Standard Printed Circuit Board and Overmoulding Technologies.” IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 10 (3): 479–86.
Chicago author-date (all authors)
Monté, Ann, Jef Daems, and Jeroen Missinne. 2020. “Fabrication of a Shear Stress Sensor Matrix Using Standard Printed Circuit Board and Overmoulding Technologies.” IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 10 (3): 479–486.
Vancouver
1.
Monté A, Daems J, Missinne J. Fabrication of a shear stress sensor matrix using standard printed circuit board and overmoulding technologies. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2020;10(3):479–86.
IEEE
[1]
A. Monté, J. Daems, and J. Missinne, “Fabrication of a shear stress sensor matrix using standard printed circuit board and overmoulding technologies,” IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, vol. 10, no. 3, pp. 479–486, 2020.
@article{8646928,
  abstract     = {In contrast to pressure distributions that can nowadays easily be measured using commercial sensor sheets, this is not yet the case for frictional or shear stresses. Those stresses act parallel to a surface which makes it more challenging to develop suitable sensors. A number of shear sensor prototypes have been reported until now, but realizing a matrix of shear sensors remains a big challenge because of cost and complexity issues. Therefore, this paper presents a fabrication approach for realizing a matrix of shear sensors using standard PCB and moulding technologies. The presented sensor is based on changing the coupling of optical power between a Light Emitting Diode and a set of photodiodes in combination with an overmoulding step, as such realizing a mechanical transducer. To demonstrate the fabrication flow, a first demonstrator incorporating a 5-taxel sensor matrix has been realized, able to record the in-plane shear stress magnitude and direction.},
  author       = {Monté, Ann and Daems, Jef and Missinne, Jeroen},
  issn         = {2156-3950},
  journal      = {IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY},
  keywords     = {frictional force,LED,mirror,optoelectronic,photodiode,sensor matrix,shear stress sensor},
  language     = {eng},
  number       = {3},
  pages        = {479--486},
  title        = {Fabrication of a shear stress sensor matrix using standard printed circuit board and overmoulding technologies},
  url          = {http://dx.doi.org/10.1109/tcpmt.2020.2969512},
  volume       = {10},
  year         = {2020},
}

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