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A hybrid integration strategy for compact, broadband, and highly efficient millimeter-wave on-chip antennas

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Abstract
A novel hybrid integration strategy for compact, broadband, and highly efficient millimeter-wave (mmWave) on-chip antennas is demonstrated by realizing a hybrid on-chip antenna, operating in the [27.5-29.5] GHz band. A cavity-backed stacked patch antenna is implemented on a 600 mu m thick silicon substrate by using air-filled substrate-integrated-waveguide technology. A hybrid on-chip approach is adopted in which the antenna feed and an air-filled cavity are integrated on-chip, and the stacked patch configuration is implemented on a high-frequency printed circuit board (PCB) laminate that supports the chip. A prototype of the hybrid on-chip antenna is validated, demonstrating an impedance bandwidth of 3.7 GHz. In free-space conditions, a boresight gain of 7.3 dBi and a front-to-back ratio of 20.3 dB at 28.5GHz are achieved. Moreover, the antenna is fabricated using standard silicon fabrication techniques and features a total antenna efficiency above 90% in the targeted frequency band of operation. The high performance, in combination with the compact antenna footprint of 0.49 lambda(min) x 0.49 lambda(min), makes it an ideal building block to construct broadband antenna arrays with a broad steering range.
Keywords
ARRAY, Air-filled substrate integrated waveguide (AFSIW), broadband, high, efficiency, millimeter-wave (mmWave), on-chip antenna

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Citation

Please use this url to cite or link to this publication:

MLA
Van den Brande, Quinten, et al. “A Hybrid Integration Strategy for Compact, Broadband, and Highly Efficient Millimeter-Wave on-Chip Antennas.” IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, vol. 18, no. 11, 2019, pp. 2424–28.
APA
Van den Brande, Q., Lemey, S., Cuyvers, S., Poelman, S., De Brabander, L., Caytan, O., … Rogier, H. (2019). A hybrid integration strategy for compact, broadband, and highly efficient millimeter-wave on-chip antennas. IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, 18(11), 2424–2428.
Chicago author-date
Van den Brande, Quinten, Sam Lemey, Stijn Cuyvers, Stijn Poelman, Lars De Brabander, Olivier Caytan, Laurens Bogaert, et al. 2019. “A Hybrid Integration Strategy for Compact, Broadband, and Highly Efficient Millimeter-Wave on-Chip Antennas.” IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS 18 (11): 2424–28.
Chicago author-date (all authors)
Van den Brande, Quinten, Sam Lemey, Stijn Cuyvers, Stijn Poelman, Lars De Brabander, Olivier Caytan, Laurens Bogaert, Igor Lima de Paula, Steven Verstuyft, Ad C. F. Reniers, Bart Smolders, Bart Kuyken, Dries Vande Ginste, and Hendrik Rogier. 2019. “A Hybrid Integration Strategy for Compact, Broadband, and Highly Efficient Millimeter-Wave on-Chip Antennas.” IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS 18 (11): 2424–2428.
Vancouver
1.
Van den Brande Q, Lemey S, Cuyvers S, Poelman S, De Brabander L, Caytan O, et al. A hybrid integration strategy for compact, broadband, and highly efficient millimeter-wave on-chip antennas. IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS. 2019;18(11):2424–8.
IEEE
[1]
Q. Van den Brande et al., “A hybrid integration strategy for compact, broadband, and highly efficient millimeter-wave on-chip antennas,” IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, vol. 18, no. 11, pp. 2424–2428, 2019.
@article{8638404,
  abstract     = {A novel hybrid integration strategy for compact, broadband, and highly efficient millimeter-wave (mmWave) on-chip antennas is demonstrated by realizing a hybrid on-chip antenna, operating in the [27.5-29.5] GHz band. A cavity-backed stacked patch antenna is implemented on a 600 mu m thick silicon substrate by using air-filled substrate-integrated-waveguide technology. A hybrid on-chip approach is adopted in which the antenna feed and an air-filled cavity are integrated on-chip, and the stacked patch configuration is implemented on a high-frequency printed circuit board (PCB) laminate that supports the chip. A prototype of the hybrid on-chip antenna is validated, demonstrating an impedance bandwidth of 3.7 GHz. In free-space conditions, a boresight gain of 7.3 dBi and a front-to-back ratio of 20.3 dB at 28.5GHz are achieved. Moreover, the antenna is fabricated using standard silicon fabrication techniques and features a total antenna efficiency above 90% in the targeted frequency band of operation. The high performance, in combination with the compact antenna footprint of 0.49 lambda(min) x 0.49 lambda(min), makes it an ideal building block to construct broadband antenna arrays with a broad steering range.},
  author       = {Van den Brande, Quinten and Lemey, Sam and Cuyvers, Stijn and Poelman, Stijn and De Brabander, Lars and Caytan, Olivier and Bogaert, Laurens and Lima de Paula, Igor and Verstuyft, Steven and Reniers, Ad C. F. and Smolders, Bart and Kuyken, Bart and Vande Ginste, Dries and Rogier, Hendrik},
  issn         = {1536-1225},
  journal      = {IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS},
  keywords     = {ARRAY,Air-filled substrate integrated waveguide (AFSIW),broadband,high,efficiency,millimeter-wave (mmWave),on-chip antenna},
  language     = {eng},
  number       = {11},
  pages        = {2424--2428},
  title        = {A hybrid integration strategy for compact, broadband, and highly efficient millimeter-wave on-chip antennas},
  url          = {http://dx.doi.org/10.1109/LAWP.2019.2929428},
  volume       = {18},
  year         = {2019},
}

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