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Broadband 3-D boundary integral equation characterization of composite conductors

Martijn Huynen (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)
(2019) 2019 IEEE 28TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2019).
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Abstract
In this contribution, an improved 3-D differential surface admittance operator is employed in the simulation of composite conductors. By utilizing closed sums of infinite series that are present in the discretized operator, increased accuracy is achieved, especially for materials with a well-developed skin effect. The performance of this method is shown through the study of examples with coated and layered interconnects over a broad frequency range.
Keywords
3-D surface admittance, boundary integral equation (BIE), interconnect modeling, SURFACE ADMITTANCE OPERATOR

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MLA
Huynen, Martijn, et al. “Broadband 3-D Boundary Integral Equation Characterization of Composite Conductors.” 2019 IEEE 28TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2019), 2019, doi:10.1109/EPEPS47316.2019.193207.
APA
Huynen, M., De Zutter, D., & Vande Ginste, D. (2019). Broadband 3-D boundary integral equation characterization of composite conductors. 2019 IEEE 28TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2019). Presented at the 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), McGill Univ, Montreal, CANADA. https://doi.org/10.1109/EPEPS47316.2019.193207
Chicago author-date
Huynen, Martijn, Daniël De Zutter, and Dries Vande Ginste. 2019. “Broadband 3-D Boundary Integral Equation Characterization of Composite Conductors.” In 2019 IEEE 28TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2019). https://doi.org/10.1109/EPEPS47316.2019.193207.
Chicago author-date (all authors)
Huynen, Martijn, Daniël De Zutter, and Dries Vande Ginste. 2019. “Broadband 3-D Boundary Integral Equation Characterization of Composite Conductors.” In 2019 IEEE 28TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2019). doi:10.1109/EPEPS47316.2019.193207.
Vancouver
1.
Huynen M, De Zutter D, Vande Ginste D. Broadband 3-D boundary integral equation characterization of composite conductors. In: 2019 IEEE 28TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2019). 2019.
IEEE
[1]
M. Huynen, D. De Zutter, and D. Vande Ginste, “Broadband 3-D boundary integral equation characterization of composite conductors,” in 2019 IEEE 28TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2019), McGill Univ, Montreal, CANADA, 2019.
@inproceedings{8629638,
  abstract     = {{In this contribution, an improved 3-D differential surface admittance operator is employed in the simulation of composite conductors. By utilizing closed sums of infinite series that are present in the discretized operator, increased accuracy is achieved, especially for materials with a well-developed skin effect. The performance of this method is shown through the study of examples with coated and layered interconnects over a broad frequency range.}},
  author       = {{Huynen, Martijn and De Zutter, Daniël and Vande Ginste, Dries}},
  booktitle    = {{2019 IEEE 28TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2019)}},
  isbn         = {{9781728145853}},
  issn         = {{2165-4107}},
  keywords     = {{3-D surface admittance,boundary integral equation (BIE),interconnect modeling,SURFACE ADMITTANCE OPERATOR}},
  language     = {{eng}},
  location     = {{McGill Univ, Montreal, CANADA}},
  pages        = {{3}},
  title        = {{Broadband 3-D boundary integral equation characterization of composite conductors}},
  url          = {{http://dx.doi.org/10.1109/EPEPS47316.2019.193207}},
  year         = {{2019}},
}
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