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An enhanced differential surface admittance operator for the signal integrity modeling of interconnects

(2019) p.1-6
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Citation

Please use this url to cite or link to this publication:

MLA
Huynen, Martijn et al. “An Enhanced Differential Surface Admittance Operator for the Signal Integrity Modeling of Interconnects.” 2019. 1–6. Print.
APA
Huynen, M., Kapusuz, K. Y., De Zutter, D., & Vande Ginste, D. (2019). An enhanced differential surface admittance operator for the signal integrity modeling of interconnects (pp. 1–6). Presented at the ICEAA2019, International Conference on Electromagnetics in Advanced Applications.
Chicago author-date
Huynen, Martijn, Kamil Yavuz Kapusuz, Daniël De Zutter, and Dries Vande Ginste. 2019. “An Enhanced Differential Surface Admittance Operator for the Signal Integrity Modeling of Interconnects.” In , 1–6.
Chicago author-date (all authors)
Huynen, Martijn, Kamil Yavuz Kapusuz, Daniël De Zutter, and Dries Vande Ginste. 2019. “An Enhanced Differential Surface Admittance Operator for the Signal Integrity Modeling of Interconnects.” In , 1–6.
Vancouver
1.
Huynen M, Kapusuz KY, De Zutter D, Vande Ginste D. An enhanced differential surface admittance operator for the signal integrity modeling of interconnects. 2019. p. 1–6.
IEEE
[1]
M. Huynen, K. Y. Kapusuz, D. De Zutter, and D. Vande Ginste, “An enhanced differential surface admittance operator for the signal integrity modeling of interconnects,” presented at the ICEAA2019, International Conference on Electromagnetics in Advanced Applications, Granada, Spain, 2019, pp. 1–6.
@inproceedings{8629635,
  author       = {Huynen, Martijn and Kapusuz, Kamil Yavuz and De Zutter, Daniël and Vande Ginste, Dries},
  isbn         = {978-1-7281-0563-5},
  location     = {Granada, Spain},
  pages        = {1--6},
  title        = {An enhanced differential surface admittance operator for the signal integrity modeling of interconnects},
  year         = {2019},
}