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III-V/Si PICs based on micro-transfer-printing

Günther Roelkens (UGent) , Jing Zhang (UGent) , Grigorij Muliuk (UGent) , Jeroen Goyvaerts (UGent) , Bahawal Haq (UGent) , Camiel Op de Beeck (UGent) , Alexandros Liles (UGent) , Zheng Wang (UGent) , Sören Dhoore (UGent) , Sulakshna Kumari (UGent) , et al.
(2019) 2019 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC).
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Abstract
III-V opto-electronic devices (photodiodes, etched facet lasers) are micro-transfer-printed onto silicon waveguide circuits. An alignment-tolerant interface for evanescently-coupled devices is proposed enabling III-V/Si heterogeneously integrated PICs using micro-transfer-printing.
Keywords
INTEGRATION

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MLA
Roelkens, Günther, et al. “III-V/Si PICs Based on Micro-Transfer-Printing.” 2019 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC), IEEE, 2019, doi:10.1364/OFC.2019.W4E.6.
APA
Roelkens, G., Zhang, J., Muliuk, G., Goyvaerts, J., Haq, B., Op de Beeck, C., … Baets, R. (2019). III-V/Si PICs based on micro-transfer-printing. In 2019 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC). San Diego, CA: IEEE. https://doi.org/10.1364/OFC.2019.W4E.6
Chicago author-date
Roelkens, Günther, Jing Zhang, Grigorij Muliuk, Jeroen Goyvaerts, Bahawal Haq, Camiel Op de Beeck, Alexandros Liles, et al. 2019. “III-V/Si PICs Based on Micro-Transfer-Printing.” In 2019 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC). IEEE. https://doi.org/10.1364/OFC.2019.W4E.6.
Chicago author-date (all authors)
Roelkens, Günther, Jing Zhang, Grigorij Muliuk, Jeroen Goyvaerts, Bahawal Haq, Camiel Op de Beeck, Alexandros Liles, Zheng Wang, Sören Dhoore, Sulakshna Kumari, Joan Juvert, Joris Van Campenhout, Bart Kuyken, Dries Van Thourhout, Brian Corbett, Antonio Jose Trindade, Chris Bower, and Roel Baets. 2019. “III-V/Si PICs Based on Micro-Transfer-Printing.” In 2019 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC). IEEE. doi:10.1364/OFC.2019.W4E.6.
Vancouver
1.
Roelkens G, Zhang J, Muliuk G, Goyvaerts J, Haq B, Op de Beeck C, et al. III-V/Si PICs based on micro-transfer-printing. In: 2019 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC). IEEE; 2019.
IEEE
[1]
G. Roelkens et al., “III-V/Si PICs based on micro-transfer-printing,” in 2019 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC), San Diego, CA, 2019.
@inproceedings{8626765,
  abstract     = {{III-V opto-electronic devices (photodiodes, etched facet lasers) are micro-transfer-printed onto silicon waveguide circuits. An alignment-tolerant interface for evanescently-coupled devices is proposed enabling III-V/Si heterogeneously integrated PICs using micro-transfer-printing.}},
  articleno    = {{paper W4E.6}},
  author       = {{Roelkens, Günther and Zhang, Jing and Muliuk, Grigorij and Goyvaerts, Jeroen and Haq, Bahawal and Op de Beeck, Camiel and Liles, Alexandros and Wang, Zheng and Dhoore, Sören and Kumari, Sulakshna and Juvert, Joan and Van Campenhout, Joris and Kuyken, Bart and Van Thourhout, Dries and Corbett, Brian and Trindade, Antonio Jose and Bower, Chris and Baets, Roel}},
  booktitle    = {{2019 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC)}},
  isbn         = {{9781943580538}},
  keywords     = {{INTEGRATION}},
  language     = {{eng}},
  location     = {{San Diego, CA}},
  pages        = {{3}},
  publisher    = {{IEEE}},
  title        = {{III-V/Si PICs based on micro-transfer-printing}},
  url          = {{http://dx.doi.org/10.1364/OFC.2019.W4E.6}},
  year         = {{2019}},
}
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