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Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3

Celine Vanhaverbeke (UGent) , Maarten Cauwe (UGent) , Arno Stockman, Maaike Op de Beeck (UGent) and Herbert De Smet (UGent)
(2019) THIN SOLID FILMS. 686.
Author
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Keywords
Materials Chemistry, Electronic, Optical and Magnetic Materials, Surfaces, Coatings and Films, Surfaces and Interfaces, Metals and Alloys

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MLA
Vanhaverbeke, Celine, et al. “Comparison of Copper Electroplating, Copper Wet Etching and Linear Sweep Voltammetry as Techniques to Investigate the Porosity of Atomic Layer Deposited Al2O3.” THIN SOLID FILMS, vol. 686, 2019, doi:10.1016/j.tsf.2019.137424.
APA
Vanhaverbeke, C., Cauwe, M., Stockman, A., Op de Beeck, M., & De Smet, H. (2019). Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3. THIN SOLID FILMS, 686. https://doi.org/10.1016/j.tsf.2019.137424
Chicago author-date
Vanhaverbeke, Celine, Maarten Cauwe, Arno Stockman, Maaike Op de Beeck, and Herbert De Smet. 2019. “Comparison of Copper Electroplating, Copper Wet Etching and Linear Sweep Voltammetry as Techniques to Investigate the Porosity of Atomic Layer Deposited Al2O3.” THIN SOLID FILMS 686. https://doi.org/10.1016/j.tsf.2019.137424.
Chicago author-date (all authors)
Vanhaverbeke, Celine, Maarten Cauwe, Arno Stockman, Maaike Op de Beeck, and Herbert De Smet. 2019. “Comparison of Copper Electroplating, Copper Wet Etching and Linear Sweep Voltammetry as Techniques to Investigate the Porosity of Atomic Layer Deposited Al2O3.” THIN SOLID FILMS 686. doi:10.1016/j.tsf.2019.137424.
Vancouver
1.
Vanhaverbeke C, Cauwe M, Stockman A, Op de Beeck M, De Smet H. Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3. THIN SOLID FILMS. 2019;686.
IEEE
[1]
C. Vanhaverbeke, M. Cauwe, A. Stockman, M. Op de Beeck, and H. De Smet, “Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3,” THIN SOLID FILMS, vol. 686, 2019.
@article{8624301,
  articleno    = {{137424}},
  author       = {{Vanhaverbeke, Celine and Cauwe, Maarten and Stockman, Arno and Op de Beeck, Maaike and De Smet, Herbert}},
  issn         = {{0040-6090}},
  journal      = {{THIN SOLID FILMS}},
  keywords     = {{Materials Chemistry,Electronic,Optical and Magnetic Materials,Surfaces,Coatings and Films,Surfaces and Interfaces,Metals and Alloys}},
  language     = {{eng}},
  title        = {{Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3}},
  url          = {{http://doi.org/10.1016/j.tsf.2019.137424}},
  volume       = {{686}},
  year         = {{2019}},
}
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