- Author
- Diederik Depla (UGent) , Koen Strijckmans (UGent) , Dulmaa Altangerel, Florian Cougnon, Robin Dedoncker, Roeland Schelfhout, Isabella Schramm (UGent) , Filip Moens and Roger De Gryse (UGent)
- Organization
- Abstract
- The complexity of the reactive magnetron sputtering process is demonstrated by four simulation examples. The examples, commonly encountered during the application of this process for thin film deposition, are described by a numerical model for reactive sputter deposition. A short description of the current model precedes these case studies. In the first example, redeposition of sputtered atoms on the target is studied by its effect on the hysteresis behavior often observed during reactive sputtering. Secondly, the complexity of current-voltage characteristics during reactive magnetron sputtering is treated. The influence of substrate rotation and the pulsing of the discharge current illustrate the time dependence of the reactive sputtering process. As a conclusion, the two main challenges for a further improvement of the model are discussed.
- Keywords
- Reactive magnetron sputtering, Modeling, LOW-FREQUENCY MODULATION, DEPOSITION, VOLTAGE, DC, BEHAVIOR
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-8622040
- MLA
- Depla, Diederik, et al. “Modeling Reactive Magnetron Sputtering : Opportunities and Challenges.” THIN SOLID FILMS, vol. 688, 2019, doi:10.1016/j.tsf.2019.05.045.
- APA
- Depla, D., Strijckmans, K., Altangerel, D., Cougnon, F., Dedoncker, R., Schelfhout, R., … De Gryse, R. (2019). Modeling reactive magnetron sputtering : opportunities and challenges. THIN SOLID FILMS, 688. https://doi.org/10.1016/j.tsf.2019.05.045
- Chicago author-date
- Depla, Diederik, Koen Strijckmans, Dulmaa Altangerel, Florian Cougnon, Robin Dedoncker, Roeland Schelfhout, Isabella Schramm, Filip Moens, and Roger De Gryse. 2019. “Modeling Reactive Magnetron Sputtering : Opportunities and Challenges.” THIN SOLID FILMS 688. https://doi.org/10.1016/j.tsf.2019.05.045.
- Chicago author-date (all authors)
- Depla, Diederik, Koen Strijckmans, Dulmaa Altangerel, Florian Cougnon, Robin Dedoncker, Roeland Schelfhout, Isabella Schramm, Filip Moens, and Roger De Gryse. 2019. “Modeling Reactive Magnetron Sputtering : Opportunities and Challenges.” THIN SOLID FILMS 688. doi:10.1016/j.tsf.2019.05.045.
- Vancouver
- 1.Depla D, Strijckmans K, Altangerel D, Cougnon F, Dedoncker R, Schelfhout R, et al. Modeling reactive magnetron sputtering : opportunities and challenges. THIN SOLID FILMS. 2019;688.
- IEEE
- [1]D. Depla et al., “Modeling reactive magnetron sputtering : opportunities and challenges,” THIN SOLID FILMS, vol. 688, 2019.
@article{8622040,
abstract = {{The complexity of the reactive magnetron sputtering process is demonstrated by four simulation examples. The examples, commonly encountered during the application of this process for thin film deposition, are described by a numerical model for reactive sputter deposition. A short description of the current model precedes these case studies. In the first example, redeposition of sputtered atoms on the target is studied by its effect on the hysteresis behavior often observed during reactive sputtering. Secondly, the complexity of current-voltage characteristics during reactive magnetron sputtering is treated. The influence of substrate rotation and the pulsing of the discharge current illustrate the time dependence of the reactive sputtering process. As a conclusion, the two main challenges for a further improvement of the model are discussed.}},
articleno = {{137326}},
author = {{Depla, Diederik and Strijckmans, Koen and Altangerel, Dulmaa and Cougnon, Florian and Dedoncker, Robin and Schelfhout, Roeland and Schramm, Isabella and Moens, Filip and De Gryse, Roger}},
issn = {{0040-6090}},
journal = {{THIN SOLID FILMS}},
keywords = {{Reactive magnetron sputtering,Modeling,LOW-FREQUENCY MODULATION,DEPOSITION,VOLTAGE,DC,BEHAVIOR}},
language = {{eng}},
pages = {{6}},
title = {{Modeling reactive magnetron sputtering : opportunities and challenges}},
url = {{http://doi.org/10.1016/j.tsf.2019.05.045}},
volume = {{688}},
year = {{2019}},
}
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