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Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics

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MLA
Mangal, Nivesh et al. “Expanded-beam Through-substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics.” 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). OSA, 2018. Print.
APA
Mangal, Nivesh, Missinne, J., Roelkens, G., Van Campenhout, J., Van Steenberge, G., & Snyder, B. (2018). Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics. 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). Presented at the Optical Fiber Communications Conference and Exposition (OFC), OSA.
Chicago author-date
Mangal, Nivesh, Jeroen Missinne, Günther Roelkens, Jan Van Campenhout, Geert Van Steenberge, and B. Snyder. 2018. “Expanded-beam Through-substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics.” In 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). OSA.
Chicago author-date (all authors)
Mangal, Nivesh, Jeroen Missinne, Günther Roelkens, Jan Van Campenhout, Geert Van Steenberge, and B. Snyder. 2018. “Expanded-beam Through-substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics.” In 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). OSA.
Vancouver
1.
Mangal N, Missinne J, Roelkens G, Van Campenhout J, Van Steenberge G, Snyder B. Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics. 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). OSA; 2018.
IEEE
[1]
N. Mangal, J. Missinne, G. Roelkens, J. Van Campenhout, G. Van Steenberge, and B. Snyder, “Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics,” in 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC), San Diego, CA, 2018.
@inproceedings{8618275,
  articleno    = {Tu2A},
  author       = {Mangal, Nivesh and Missinne, Jeroen and Roelkens, Günther and Van Campenhout, Jan and Van Steenberge, Geert and Snyder, B.},
  booktitle    = {2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)},
  isbn         = {9781943580385},
  language     = {eng},
  location     = {San Diego, CA},
  pages        = {3},
  publisher    = {OSA},
  title        = {Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics},
  url          = {http://dx.doi.org/10.1364/OFC.2018.Tu2A.1},
  year         = {2018},
}

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