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Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects

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MLA
Mangal, Nivesh, et al. “Through-Substrate Coupling Elements for Silicon-Photonics-Based Short-Reach Optical Interconnects.” OPTICAL INTERCONNECTS XIX, edited by Henning Schröder and Ray T. Chen, vol. 10924, SPIE, 2019.
APA
Mangal, N., Missinne, J., Van Campenhout, J., Van Steenberge, G., & Snyder, B. (2019). Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects. In H. Schröder & R. T. Chen (Eds.), OPTICAL INTERCONNECTS XIX (Vol. 10924). San Francisco, CA: SPIE.
Chicago author-date
Mangal, Nivesh, Jeroen Missinne, Joris Van Campenhout, Geert Van Steenberge, and Bradley Snyder. 2019. “Through-Substrate Coupling Elements for Silicon-Photonics-Based Short-Reach Optical Interconnects.” In OPTICAL INTERCONNECTS XIX, edited by Henning Schröder and Ray T. Chen. Vol. 10924. SPIE.
Chicago author-date (all authors)
Mangal, Nivesh, Jeroen Missinne, Joris Van Campenhout, Geert Van Steenberge, and Bradley Snyder. 2019. “Through-Substrate Coupling Elements for Silicon-Photonics-Based Short-Reach Optical Interconnects.” In OPTICAL INTERCONNECTS XIX, ed by. Henning Schröder and Ray T. Chen. Vol. 10924. SPIE.
Vancouver
1.
Mangal N, Missinne J, Van Campenhout J, Van Steenberge G, Snyder B. Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects. In: Schröder H, Chen RT, editors. OPTICAL INTERCONNECTS XIX. SPIE; 2019.
IEEE
[1]
N. Mangal, J. Missinne, J. Van Campenhout, G. Van Steenberge, and B. Snyder, “Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects,” in OPTICAL INTERCONNECTS XIX, San Francisco, CA, 2019, vol. 10924.
@inproceedings{8618267,
  articleno    = {109240D},
  author       = {Mangal, Nivesh and Missinne, Jeroen and Van Campenhout, Joris and Van Steenberge, Geert and Snyder, Bradley},
  booktitle    = {OPTICAL INTERCONNECTS XIX},
  editor       = {Schröder, Henning and Chen, Ray T.},
  isbn         = {9781510624900},
  issn         = {0277-786X},
  language     = {eng},
  location     = {San Francisco, CA},
  pages        = {12},
  publisher    = {SPIE},
  title        = {Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects},
  url          = {http://dx.doi.org/10.1117/12.2510594},
  volume       = {10924},
  year         = {2019},
}

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