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The Seebeck coefficient of sputter deposited metallic thin films : the role of process conditions

Florian Cougnon (UGent) and Diederik Depla (UGent)
(2019) COATINGS. 9(5).
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Please use this url to cite or link to this publication:

Chicago
Cougnon, Florian, and Diederik Depla. 2019. “The Seebeck Coefficient of Sputter Deposited Metallic Thin Films : the Role of Process Conditions.” Coatings 9 (5).
APA
Cougnon, F., & Depla, D. (2019). The Seebeck coefficient of sputter deposited metallic thin films : the role of process conditions. COATINGS, 9(5).
Vancouver
1.
Cougnon F, Depla D. The Seebeck coefficient of sputter deposited metallic thin films : the role of process conditions. COATINGS. 2019;9(5).
MLA
Cougnon, Florian, and Diederik Depla. “The Seebeck Coefficient of Sputter Deposited Metallic Thin Films : the Role of Process Conditions.” COATINGS 9.5 (2019): n. pag. Print.
@article{8614429,
  articleno    = {299},
  author       = {Cougnon, Florian and Depla, Diederik},
  issn         = {2079-6412},
  journal      = {COATINGS},
  language     = {eng},
  number       = {5},
  pages        = {13},
  title        = {The Seebeck coefficient of sputter deposited metallic thin films : the role of process conditions},
  url          = {http://dx.doi.org/10.3390/coatings9050299},
  volume       = {9},
  year         = {2019},
}

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