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The (in)stability of process control mechanisms in reactive DC sputtering deposition

Koen Strijckmans (UGent) , Roeland Schelfhout (UGent) and Diederik Depla (UGent)
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MLA
Strijckmans, Koen, et al. “The (in)Stability of Process Control Mechanisms in Reactive DC Sputtering Deposition.” Plasma Surface Engineering, 16th International Conference, Abstracts, 2018, doi:10.13140/RG.2.2.28368.15364.
APA
Strijckmans, K., Schelfhout, R., & Depla, D. (2018). The (in)stability of process control mechanisms in reactive DC sputtering deposition. In Plasma Surface Engineering, 16th International conference, Abstracts. Garmisch-Partenkirchen, Germany. https://doi.org/10.13140/RG.2.2.28368.15364
Chicago author-date
Strijckmans, Koen, Roeland Schelfhout, and Diederik Depla. 2018. “The (in)Stability of Process Control Mechanisms in Reactive DC Sputtering Deposition.” In Plasma Surface Engineering, 16th International Conference, Abstracts. https://doi.org/10.13140/RG.2.2.28368.15364.
Chicago author-date (all authors)
Strijckmans, Koen, Roeland Schelfhout, and Diederik Depla. 2018. “The (in)Stability of Process Control Mechanisms in Reactive DC Sputtering Deposition.” In Plasma Surface Engineering, 16th International Conference, Abstracts. doi:10.13140/RG.2.2.28368.15364.
Vancouver
1.
Strijckmans K, Schelfhout R, Depla D. The (in)stability of process control mechanisms in reactive DC sputtering deposition. In: Plasma Surface Engineering, 16th International conference, Abstracts. 2018.
IEEE
[1]
K. Strijckmans, R. Schelfhout, and D. Depla, “The (in)stability of process control mechanisms in reactive DC sputtering deposition,” in Plasma Surface Engineering, 16th International conference, Abstracts, Garmisch-Partenkirchen, Germany, 2018.
@inproceedings{8612298,
  author       = {{Strijckmans, Koen and Schelfhout, Roeland and Depla, Diederik}},
  booktitle    = {{Plasma Surface Engineering, 16th International conference, Abstracts}},
  language     = {{eng}},
  location     = {{Garmisch-Partenkirchen, Germany}},
  title        = {{The (in)stability of process control mechanisms in reactive DC sputtering deposition}},
  url          = {{http://dx.doi.org/10.13140/RG.2.2.28368.15364}},
  year         = {{2018}},
}

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