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Stretchable mould interconnect optimization : peeling automation and carrierless techniques

Bart Plovie (UGent) , Yang Yang, Sheila Dunphy (UGent) , Kristof Dhaenens (UGent) , Steven Van Put (UGent) , Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)
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Abstract
The primary bottleneck of the stretchable mold interconnect (SMI) technology is its reliance on carrier boards. These are necessary to handle the meandered circuit during production and to ensure dimensional stability of the flexible circuit board before encapsulation. However, for all the problems it solves, it also introduces a new major problem by requiring a peeling step – which is difficult to automate. This manuscript aims to present some of the work that went into eliminating this problem, discussing both unsuccessful and functioning methods to tackle this conundrum and some of the experimental work that went into verifying these techniques. First, alterations to the design to simplify peeling are considered, followed by adhesivebased peeling processes and mechanical pin-based systems. Next, masking and structuring of the carrier board adhesive are considered. Finally, two carrierless methods which circumvent the problems are discussed, a two-step process – which cuts temporary support structures after partial encapsulation – and a technique whereby the frame is designed to fail in a controlled manner during the first use of the circuit, creating a carrierless process feasible for high-volume production.
Keywords
Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Automation, flexible, process development, stretchable, stretchable mold interconnect (SMI), substrate peeling, FABRICATION, DESIGN

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MLA
Plovie, Bart, et al. “Stretchable Mould Interconnect Optimization : Peeling Automation and Carrierless Techniques.” IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, vol. 9, no. 5, 2019, pp. 955–62.
APA
Plovie, B., Yang, Y., Dunphy, S., Dhaenens, K., Van Put, S., Bossuyt, F., & Vanfleteren, J. (2019). Stretchable mould interconnect optimization : peeling automation and carrierless techniques. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 9(5), 955–962.
Chicago author-date
Plovie, Bart, Yang Yang, Sheila Dunphy, Kristof Dhaenens, Steven Van Put, Frederick Bossuyt, and Jan Vanfleteren. 2019. “Stretchable Mould Interconnect Optimization : Peeling Automation and Carrierless Techniques.” IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 9 (5): 955–62.
Chicago author-date (all authors)
Plovie, Bart, Yang Yang, Sheila Dunphy, Kristof Dhaenens, Steven Van Put, Frederick Bossuyt, and Jan Vanfleteren. 2019. “Stretchable Mould Interconnect Optimization : Peeling Automation and Carrierless Techniques.” IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 9 (5): 955–962.
Vancouver
1.
Plovie B, Yang Y, Dunphy S, Dhaenens K, Van Put S, Bossuyt F, et al. Stretchable mould interconnect optimization : peeling automation and carrierless techniques. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2019;9(5):955–62.
IEEE
[1]
B. Plovie et al., “Stretchable mould interconnect optimization : peeling automation and carrierless techniques,” IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, vol. 9, no. 5, pp. 955–962, 2019.
@article{8612041,
  abstract     = {The primary bottleneck of the stretchable mold interconnect (SMI) technology is its reliance on carrier boards. These are necessary to handle the meandered circuit during production and to ensure dimensional stability of the flexible circuit board before encapsulation. However, for all the problems it solves, it also introduces a new major problem by requiring a peeling step – which is difficult to automate. This manuscript aims to present some of the work that went into eliminating this problem, discussing both unsuccessful and functioning methods to tackle this conundrum and some of the experimental work that went into verifying these techniques. First, alterations to the design to simplify peeling are considered, followed by adhesivebased peeling processes and mechanical pin-based systems. Next, masking and structuring of the carrier board adhesive are considered. Finally, two carrierless methods which circumvent the problems are discussed, a two-step process – which cuts temporary support structures after partial encapsulation – and a technique whereby the frame is designed to fail in a controlled manner during the first use of the circuit, creating a carrierless process feasible for high-volume production.},
  author       = {Plovie, Bart and Yang, Yang and Dunphy, Sheila and Dhaenens, Kristof and Van Put, Steven and Bossuyt, Frederick and Vanfleteren, Jan},
  issn         = {2156-3950},
  journal      = {IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY},
  keywords     = {Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic,Optical and Magnetic Materials,Automation,flexible,process development,stretchable,stretchable mold interconnect (SMI),substrate peeling,FABRICATION,DESIGN},
  language     = {eng},
  number       = {5},
  pages        = {955--962},
  title        = {Stretchable mould interconnect optimization : peeling automation and carrierless techniques},
  url          = {http://dx.doi.org/10.1109/tcpmt.2019.2906115},
  volume       = {9},
  year         = {2019},
}

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