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Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics

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Center for nano- and biophotonics (NB-Photonics)
Abstract
We demonstrate an alignment tolerant through-substrate coupling interface by combining an optimized downward-directionality grating on a silicon photonic chip with a hybrid integrated polymer lens, generating a collimated beam at lambda = 1310nm for more than 600 mu m.

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Citation

Please use this url to cite or link to this publication:

Chicago
Mangal, N., J. Missinne, Günther Roelkens, J. Van Campenhout, Geert Van Steenberge, and B. Snyder. 2018. “Expanded-beam Through-substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics.” In 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). IEEE.
APA
Mangal, N., Missinne, J., Roelkens, G., Van Campenhout, J., Van Steenberge, G., & Snyder, B. (2018). Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics. 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). Presented at the Optical Fiber Communications Conference and Exposition (OFC), IEEE.
Vancouver
1.
Mangal N, Missinne J, Roelkens G, Van Campenhout J, Van Steenberge G, Snyder B. Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics. 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). IEEE; 2018.
MLA
Mangal, N. et al. “Expanded-beam Through-substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics.” 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). IEEE, 2018. Print.
@inproceedings{8606054,
  abstract     = {We demonstrate an alignment tolerant through-substrate coupling interface by combining an optimized downward-directionality grating on a silicon photonic chip with a hybrid integrated polymer lens, generating a collimated beam at lambda = 1310nm for more than 600 mu m.},
  articleno    = {Tu2A.1},
  author       = {Mangal, N. and Missinne, J. and Roelkens, G{\"u}nther and Van Campenhout, J. and Van Steenberge, Geert and Snyder, B.},
  booktitle    = {2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)},
  isbn         = {9781943580385},
  language     = {eng},
  location     = {San Diego, CA},
  pages        = {3},
  publisher    = {IEEE},
  title        = {Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics},
  url          = {http://dx.doi.org/10.1364/ofc.2018.tu2a.1},
  year         = {2018},
}

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