
Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics
- Author
- Nivesh Mangal (UGent) , Jeroen Missinne (UGent) , Günther Roelkens (UGent) , Jan Van Campenhout (UGent) , Geert Van Steenberge (UGent) and B. Snyder
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- Abstract
- We demonstrate an alignment tolerant through-substrate coupling interface by combining an optimized downward-directionality grating on a silicon photonic chip with a hybrid integrated polymer lens, generating a collimated beam at lambda = 1310nm for more than 600 mu m.
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-8606054
- MLA
- Mangal, Nivesh, et al. “Expanded-Beam through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics.” 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC), IEEE, 2018.
- APA
- Mangal, N., Missinne, J., Roelkens, G., Van Campenhout, J., Van Steenberge, G., & Snyder, B. (2018). Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics. In 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). San Diego, CA: IEEE.
- Chicago author-date
- Mangal, Nivesh, Jeroen Missinne, Günther Roelkens, Jan Van Campenhout, Geert Van Steenberge, and B. Snyder. 2018. “Expanded-Beam through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics.” In 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). IEEE.
- Chicago author-date (all authors)
- Mangal, Nivesh, Jeroen Missinne, Günther Roelkens, Jan Van Campenhout, Geert Van Steenberge, and B. Snyder. 2018. “Expanded-Beam through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics.” In 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). IEEE.
- Vancouver
- 1.Mangal N, Missinne J, Roelkens G, Van Campenhout J, Van Steenberge G, Snyder B. Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics. In: 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). IEEE; 2018.
- IEEE
- [1]N. Mangal, J. Missinne, G. Roelkens, J. Van Campenhout, G. Van Steenberge, and B. Snyder, “Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics,” in 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC), San Diego, CA, 2018.
@inproceedings{8606054, abstract = {We demonstrate an alignment tolerant through-substrate coupling interface by combining an optimized downward-directionality grating on a silicon photonic chip with a hybrid integrated polymer lens, generating a collimated beam at lambda = 1310nm for more than 600 mu m.}, articleno = {Tu2A.1}, author = {Mangal, Nivesh and Missinne, Jeroen and Roelkens, Günther and Van Campenhout, Jan and Van Steenberge, Geert and Snyder, B.}, booktitle = {2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)}, isbn = {9781943580385}, language = {eng}, location = {San Diego, CA}, pages = {3}, publisher = {IEEE}, title = {Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics}, url = {http://dx.doi.org/10.1364/ofc.2018.tu2a.1}, year = {2018}, }
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