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Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics

Nivesh Mangal (UGent) , Jeroen Missinne (UGent) , Günther Roelkens (UGent) , Jan Van Campenhout (UGent) , Geert Van Steenberge (UGent) and B. Snyder
(2018) 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC).
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Abstract
We demonstrate an alignment tolerant through-substrate coupling interface by combining an optimized downward-directionality grating on a silicon photonic chip with a hybrid integrated polymer lens, generating a collimated beam at lambda = 1310nm for more than 600 mu m.

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Citation

Please use this url to cite or link to this publication:

MLA
Mangal, Nivesh, et al. “Expanded-Beam through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics.” 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC), IEEE, 2018.
APA
Mangal, N., Missinne, J., Roelkens, G., Van Campenhout, J., Van Steenberge, G., & Snyder, B. (2018). Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics. In 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). San Diego, CA: IEEE.
Chicago author-date
Mangal, Nivesh, Jeroen Missinne, Günther Roelkens, Jan Van Campenhout, Geert Van Steenberge, and B. Snyder. 2018. “Expanded-Beam through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics.” In 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). IEEE.
Chicago author-date (all authors)
Mangal, Nivesh, Jeroen Missinne, Günther Roelkens, Jan Van Campenhout, Geert Van Steenberge, and B. Snyder. 2018. “Expanded-Beam through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics.” In 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). IEEE.
Vancouver
1.
Mangal N, Missinne J, Roelkens G, Van Campenhout J, Van Steenberge G, Snyder B. Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics. In: 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). IEEE; 2018.
IEEE
[1]
N. Mangal, J. Missinne, G. Roelkens, J. Van Campenhout, G. Van Steenberge, and B. Snyder, “Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics,” in 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC), San Diego, CA, 2018.
@inproceedings{8606054,
  abstract     = {We demonstrate an alignment tolerant through-substrate coupling interface by combining an optimized downward-directionality grating on a silicon photonic chip with a hybrid integrated polymer lens, generating a collimated beam at lambda = 1310nm for more than 600 mu m.},
  articleno    = {Tu2A.1},
  author       = {Mangal, Nivesh and Missinne, Jeroen and Roelkens, Günther and Van Campenhout, Jan and Van Steenberge, Geert and Snyder, B.},
  booktitle    = {2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)},
  isbn         = {9781943580385},
  language     = {eng},
  location     = {San Diego, CA},
  pages        = {3},
  publisher    = {IEEE},
  title        = {Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics},
  url          = {http://dx.doi.org/10.1364/ofc.2018.tu2a.1},
  year         = {2018},
}
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