Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics
- Author
- N. Mangal, J. Missinne, Günther Roelkens (UGent) , J. Van Campenhout, Geert Van Steenberge (UGent) and B. Snyder
- Organization
- Project
- Center for nano- and biophotonics (NB-Photonics)
- Abstract
- We demonstrate an alignment tolerant through-substrate coupling interface by combining an optimized downward-directionality grating on a silicon photonic chip with a hybrid integrated polymer lens, generating a collimated beam at lambda = 1310nm for more than 600 mu m.
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-8606054
- Chicago
- Mangal, N., J. Missinne, Günther Roelkens, J. Van Campenhout, Geert Van Steenberge, and B. Snyder. 2018. “Expanded-beam Through-substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics.” In 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). IEEE.
- APA
- Mangal, N., Missinne, J., Roelkens, G., Van Campenhout, J., Van Steenberge, G., & Snyder, B. (2018). Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics. 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). Presented at the Optical Fiber Communications Conference and Exposition (OFC), IEEE.
- Vancouver
- 1.Mangal N, Missinne J, Roelkens G, Van Campenhout J, Van Steenberge G, Snyder B. Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics. 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). IEEE; 2018.
- MLA
- Mangal, N. et al. “Expanded-beam Through-substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics.” 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). IEEE, 2018. Print.
@inproceedings{8606054,
abstract = {We demonstrate an alignment tolerant through-substrate coupling interface by combining an optimized downward-directionality grating on a silicon photonic chip with a hybrid integrated polymer lens, generating a collimated beam at lambda = 1310nm for more than 600 mu m.},
articleno = {Tu2A.1},
author = {Mangal, N. and Missinne, J. and Roelkens, G{\"u}nther and Van Campenhout, J. and Van Steenberge, Geert and Snyder, B.},
booktitle = {2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)},
isbn = {9781943580385},
language = {eng},
location = {San Diego, CA},
pages = {3},
publisher = {IEEE},
title = {Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics},
url = {http://dx.doi.org/10.1364/ofc.2018.tu2a.1},
year = {2018},
}
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