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Methodologically study for detection of thermal induced pain via skin impedance

Mihaela Ghita (UGent) , Maria Ghita (UGent) , Dana Copot (UGent) and Clara-Mihaela Ionescu (UGent)
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Citation

Please use this url to cite or link to this publication:

MLA
Ghita, Mihaela et al. “Methodologically Study for Detection of Thermal Induced Pain via Skin Impedance.” Proceedings of the IEEE 17th World Symposium on Applied Machine Intelligence and Informatics. 2019. 323–326. Print.
APA
Ghita, Mihaela, Ghita, M., Copot, D., & Ionescu, C.-M. (2019). Methodologically study for detection of thermal induced pain via skin impedance. Proceedings of the IEEE 17th World Symposium on Applied Machine Intelligence and Informatics (pp. 323–326). Presented at the IEEE 17th World Symposium on Applied Machine Intelligence and Informatics.
Chicago author-date
Ghita, Mihaela, Maria Ghita, Dana Copot, and Clara-Mihaela Ionescu. 2019. “Methodologically Study for Detection of Thermal Induced Pain via Skin Impedance.” In Proceedings of the IEEE 17th World Symposium on Applied Machine Intelligence and Informatics, 323–326.
Chicago author-date (all authors)
Ghita, Mihaela, Maria Ghita, Dana Copot, and Clara-Mihaela Ionescu. 2019. “Methodologically Study for Detection of Thermal Induced Pain via Skin Impedance.” In Proceedings of the IEEE 17th World Symposium on Applied Machine Intelligence and Informatics, 323–326.
Vancouver
1.
Ghita M, Ghita M, Copot D, Ionescu C-M. Methodologically study for detection of thermal induced pain via skin impedance. Proceedings of the IEEE 17th World Symposium on Applied Machine Intelligence and Informatics. 2019. p. 323–6.
IEEE
[1]
M. Ghita, M. Ghita, D. Copot, and C.-M. Ionescu, “Methodologically study for detection of thermal induced pain via skin impedance,” in Proceedings of the IEEE 17th World Symposium on Applied Machine Intelligence and Informatics, Herl’any, Slovakia, 2019, pp. 323–326.
@inproceedings{8605231,
  author       = {Ghita, Mihaela and Ghita, Maria and Copot, Dana and Ionescu, Clara-Mihaela},
  booktitle    = {Proceedings of the IEEE 17th World Symposium on Applied Machine Intelligence and Informatics},
  language     = {eng},
  location     = {Herl’any, Slovakia},
  pages        = {323--326},
  title        = {Methodologically study for detection of thermal induced pain via skin impedance},
  year         = {2019},
}