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Fully embedded optical and electrical interconnections in flexible foils

Erwin Bosman (UGent) , Geert Van Steenberge (UGent) , Peter Geerinck (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)
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Abstract
This paper presents the development of a technology platform for the full integration of opto-electronic and electronic components, as well as optical interconnections in a flexible foil. A technology is developed to embed ultra thin (20 μ m) VCSEL's and Photodiodes in layers of optical transparent material. These layers are sandwiched in between two Polyimide layers to get a flexible foil with a final stack thickness of 150 μ m. Optical waveguides are structured by photolithography in the optical layers and pluggable mirror components couple the light from the embedded opto-electronics in and out of the waveguides. Besides optical links and optoelectronic components, electrical circuitry is also embedded by means of embedded copper tracks and thinned down Integrated Circuits (20 μ m). Optical connection towards the outer world is realized by U-groove passive alignment coupling of optical fibers with the embedded waveguides.
Keywords
optical interconnect, embedding, VCSEL, thin chip, flexible, Opto-electronic packaging

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MLA
Bosman, Erwin et al. “Fully Embedded Optical and Electrical Interconnections in Flexible Foils.” 2009 European Microelectronics and Packaging Conference (EMPC 2009), Vols 1 and 2. New York, NY, USA: IEEE, 2009. 275–279. Print.
APA
Bosman, E., Van Steenberge, G., Geerinck, P., Vanfleteren, J., & Van Daele, P. (2009). Fully embedded optical and electrical interconnections in flexible foils. 2009 European Microelectronics and Packaging Conference (EMPC 2009), vols 1 and 2 (pp. 275–279). Presented at the 17th European Microelectronics and Packaging Conference (EMPC 2009), New York, NY, USA: IEEE.
Chicago author-date
Bosman, Erwin, Geert Van Steenberge, Peter Geerinck, Jan Vanfleteren, and Peter Van Daele. 2009. “Fully Embedded Optical and Electrical Interconnections in Flexible Foils.” In 2009 European Microelectronics and Packaging Conference (EMPC 2009), Vols 1 and 2, 275–279. New York, NY, USA: IEEE.
Chicago author-date (all authors)
Bosman, Erwin, Geert Van Steenberge, Peter Geerinck, Jan Vanfleteren, and Peter Van Daele. 2009. “Fully Embedded Optical and Electrical Interconnections in Flexible Foils.” In 2009 European Microelectronics and Packaging Conference (EMPC 2009), Vols 1 and 2, 275–279. New York, NY, USA: IEEE.
Vancouver
1.
Bosman E, Van Steenberge G, Geerinck P, Vanfleteren J, Van Daele P. Fully embedded optical and electrical interconnections in flexible foils. 2009 European Microelectronics and Packaging Conference (EMPC 2009), vols 1 and 2. New York, NY, USA: IEEE; 2009. p. 275–9.
IEEE
[1]
E. Bosman, G. Van Steenberge, P. Geerinck, J. Vanfleteren, and P. Van Daele, “Fully embedded optical and electrical interconnections in flexible foils,” in 2009 European Microelectronics and Packaging Conference (EMPC 2009), vols 1 and 2, Rimini, Italy, 2009, pp. 275–279.
@inproceedings{858687,
  abstract     = {This paper presents the development of a technology platform for the full integration of opto-electronic and electronic components, as well as optical interconnections in a flexible foil. A technology is developed to embed ultra thin (20 μ m) VCSEL's and Photodiodes in layers of optical transparent material. These layers are sandwiched in between two Polyimide layers to get a flexible foil with a final stack thickness of 150 μ m. Optical waveguides are structured by photolithography in the optical layers and pluggable mirror components couple the light from the embedded opto-electronics in and out of the waveguides. Besides optical links and optoelectronic components, electrical circuitry is also embedded by means of embedded copper tracks and thinned down Integrated Circuits (20 μ m). Optical connection towards the outer world is realized by U-groove passive alignment coupling of optical fibers with the embedded waveguides.},
  author       = {Bosman, Erwin and Van Steenberge, Geert and Geerinck, Peter and Vanfleteren, Jan and Van Daele, Peter},
  booktitle    = {2009 European Microelectronics and Packaging Conference (EMPC 2009), vols 1 and 2},
  isbn         = {9781424447220},
  keywords     = {optical interconnect,embedding,VCSEL,thin chip,flexible,Opto-electronic packaging},
  language     = {eng},
  location     = {Rimini, Italy},
  pages        = {275--279},
  publisher    = {IEEE},
  title        = {Fully embedded optical and electrical interconnections in flexible foils},
  year         = {2009},
}

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