Advanced search
3 files | 20.12 MB Add to list

3D multifunctional composites based on large-area stretchable circuit with thermoforming technology

Yang Yang (UGent) , Thomas Vervust (UGent) , Sheila Dunphy (UGent) , Steven Van Put (UGent) , Bjorn Vandecasteele (UGent) , Kristof Dhaenens (UGent) , Lieven Degrendele (UGent) , Lothar Mader (UGent) , Linde De Vriese, Tom Martens, et al.
Author
Organization
Abstract
Fiber-reinforced polymer composites with integrated intelligence, such as sensors, actuators, and communication capabilities, are desirable as infrastructures for the next generation of "internet of things." However, the shape mismatch between the 3D composites and a planar electronic circuit causes difficulties in integrating electronic circuit-based intelligences. Here, an easily scalable approach, by incorporating a large-area stretchable circuit with thermoforming technology, to fabricate 3D multifunctional composites is reported. The stretchable circuit is first fabricated on a rigid and planar carrier board, then transferred and sandwiched between thermoplastic composites through lamination processes. A thermoforming step shapes the sandwiched and planar structure by heating up the encapsulating polymers beyond their glass transition temperature and pushing them and the circuit against a mold. Using the proposed process, large-sized composites with integrated matrices of light-emitting diodes (LEDs) and capacitive sensors are successfully fabricated. A giant (with a size of 0.5 m x 1 m) seven-segment display is assembled using the fabricated composites with integrated LEDs and capacitive sensors to display 128 symbols. The results demonstrate the potential of the proposed approach as a facile, reproducible, and scalable process for creating 3D multifunctional composites.
Keywords
IN-SITU, NANOWIRE CONDUCTORS, ELASTIC CONDUCTORS, HIGH-PERFORMANCE, ELECTRONIC-SKIN, FABRICATION, SENSOR, DESIGN, SILVER, LIGHT, stretchable circuit, thermoforming, thermoplastic composites

Downloads

  • (...).mp4
    • supplementary material
    • |
    • UGent only
    • |
    • video/mp4
    • |
    • 16.42 MB
  • (...).pdf
    • supplementary material
    • |
    • UGent only
    • |
    • PDF
    • |
    • 362.39 KB
  • (...).pdf
    • full text
    • |
    • UGent only
    • |
    • PDF
    • |
    • 3.33 MB

Citation

Please use this url to cite or link to this publication:

MLA
Yang, Yang et al. “3D Multifunctional Composites Based on Large-area Stretchable Circuit with Thermoforming Technology.” ADVANCED ELECTRONIC MATERIALS 4.8 (2018): n. pag. Print.
APA
Yang, Yang, Vervust, T., Dunphy, S., Van Put, S., Vandecasteele, B., Dhaenens, K., Degrendele, L., et al. (2018). 3D multifunctional composites based on large-area stretchable circuit with thermoforming technology. ADVANCED ELECTRONIC MATERIALS, 4(8).
Chicago author-date
Yang, Yang, Thomas Vervust, Sheila Dunphy, Steven Van Put, Bjorn Vandecasteele, Kristof Dhaenens, Lieven Degrendele, et al. 2018. “3D Multifunctional Composites Based on Large-area Stretchable Circuit with Thermoforming Technology.” Advanced Electronic Materials 4 (8).
Chicago author-date (all authors)
Yang, Yang, Thomas Vervust, Sheila Dunphy, Steven Van Put, Bjorn Vandecasteele, Kristof Dhaenens, Lieven Degrendele, Lothar Mader, Linde De Vriese, Tom Martens, Markus Kaufmann, Tsuyoshi Sekitani, and Jan Vanfleteren. 2018. “3D Multifunctional Composites Based on Large-area Stretchable Circuit with Thermoforming Technology.” Advanced Electronic Materials 4 (8).
Vancouver
1.
Yang Y, Vervust T, Dunphy S, Van Put S, Vandecasteele B, Dhaenens K, et al. 3D multifunctional composites based on large-area stretchable circuit with thermoforming technology. ADVANCED ELECTRONIC MATERIALS. Hoboken: Wiley; 2018;4(8).
IEEE
[1]
Y. Yang et al., “3D multifunctional composites based on large-area stretchable circuit with thermoforming technology,” ADVANCED ELECTRONIC MATERIALS, vol. 4, no. 8, 2018.
@article{8586654,
  abstract     = {Fiber-reinforced polymer composites with integrated intelligence, such as sensors, actuators, and communication capabilities, are desirable as infrastructures for the next generation of "internet of things." However, the shape mismatch between the 3D composites and a planar electronic circuit causes difficulties in integrating electronic circuit-based intelligences. Here, an easily scalable approach, by incorporating a large-area stretchable circuit with thermoforming technology, to fabricate 3D multifunctional composites is reported. The stretchable circuit is first fabricated on a rigid and planar carrier board, then transferred and sandwiched between thermoplastic composites through lamination processes. A thermoforming step shapes the sandwiched and planar structure by heating up the encapsulating polymers beyond their glass transition temperature and pushing them and the circuit against a mold. Using the proposed process, large-sized composites with integrated matrices of light-emitting diodes (LEDs) and capacitive sensors are successfully fabricated. A giant (with a size of 0.5 m x 1 m) seven-segment display is assembled using the fabricated composites with integrated LEDs and capacitive sensors to display 128 symbols. The results demonstrate the potential of the proposed approach as a facile, reproducible, and scalable process for creating 3D multifunctional composites.},
  articleno    = {1800071},
  author       = {Yang, Yang and Vervust, Thomas and Dunphy, Sheila and Van Put, Steven and Vandecasteele, Bjorn and Dhaenens, Kristof and Degrendele, Lieven and Mader, Lothar and De Vriese, Linde and Martens, Tom and Kaufmann, Markus and Sekitani, Tsuyoshi and Vanfleteren, Jan},
  issn         = {2199-160X},
  journal      = {ADVANCED ELECTRONIC MATERIALS},
  keywords     = {IN-SITU,NANOWIRE CONDUCTORS,ELASTIC CONDUCTORS,HIGH-PERFORMANCE,ELECTRONIC-SKIN,FABRICATION,SENSOR,DESIGN,SILVER,LIGHT,stretchable circuit,thermoforming,thermoplastic composites},
  language     = {eng},
  number       = {8},
  pages        = {10},
  publisher    = {Wiley},
  title        = {3D multifunctional composites based on large-area stretchable circuit with thermoforming technology},
  url          = {http://dx.doi.org/10.1002/aelm.201800071},
  volume       = {4},
  year         = {2018},
}

Altmetric
View in Altmetric
Web of Science
Times cited: