Aerosol-Jet printed interconnects for 60-Gb/s CMOS driver and microring modulator transmitter assembly
- Author
- Ahmed Elmogi, Hannes Ramon, Joris Lambrecht (UGent) , Peter Ossieur (UGent) , Guy Torfs (UGent) , Jeroen Missinne (UGent) , Peter De Heyn (UGent) , Yoojin Ban (UGent) , Marianna Pantouvaki, Joris Van Campenhout and Geert Van Steenberge (UGent)
- Organization
- Abstract
- We developed an aerosol-jet printing technique to realize an optical transmitter assembly of a microring modulator and a high-speed CMOS driver in which the bonding wires are replaced by aerosol-jet printed silver interconnects. First, the technology is characterized by printing coplanar waveguides (CPWs) test structures on glass and epoxy in order to fully investigate the electro-magnetic behavior of the aerosol-jet printed interconnects. The printed CPWs on glass and epoxy showed a low attenuation of 0.57 and 0.76 dB/mm at 50 GHz, respectively. Then, the aerosol-jet printed interconnects were benchmarked with conventional bonding wires while separately interconnecting the ring modulator without the CMOS driver. The measured reflection coefficient (S-11) of the aerosoljet printed interconnects showed an increase in a resonance frequency of 20 GHz compared with Al bonding wires. Furthermore, the optical transmitter was successfully demonstrated at 60 Gb/s and the measured optical eye diagrams were clearly open even after 2 km of standard single-mode fiber. An extinction ratio of 4.63 dB was achieved while applying a drive voltage of 1 V-pp.
- Keywords
- Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials, Aerosol-jet, electrical interconnects, ring modulator, CMOS driver, coplanar, waveguide, DEVICES
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-8581741
- MLA
- Elmogi, Ahmed, et al. “Aerosol-Jet Printed Interconnects for 60-Gb/s CMOS Driver and Microring Modulator Transmitter Assembly.” IEEE PHOTONICS TECHNOLOGY LETTERS, vol. 30, no. 22, Institute of Electrical and Electronics Engineers (IEEE), 2018, pp. 1944–47, doi:10.1109/lpt.2018.2873056.
- APA
- Elmogi, A., Ramon, H., Lambrecht, J., Ossieur, P., Torfs, G., Missinne, J., … Van Steenberge, G. (2018). Aerosol-Jet printed interconnects for 60-Gb/s CMOS driver and microring modulator transmitter assembly. IEEE PHOTONICS TECHNOLOGY LETTERS, 30(22), 1944–1947. https://doi.org/10.1109/lpt.2018.2873056
- Chicago author-date
- Elmogi, Ahmed, Hannes Ramon, Joris Lambrecht, Peter Ossieur, Guy Torfs, Jeroen Missinne, Peter De Heyn, et al. 2018. “Aerosol-Jet Printed Interconnects for 60-Gb/s CMOS Driver and Microring Modulator Transmitter Assembly.” IEEE PHOTONICS TECHNOLOGY LETTERS 30 (22): 1944–47. https://doi.org/10.1109/lpt.2018.2873056.
- Chicago author-date (all authors)
- Elmogi, Ahmed, Hannes Ramon, Joris Lambrecht, Peter Ossieur, Guy Torfs, Jeroen Missinne, Peter De Heyn, Yoojin Ban, Marianna Pantouvaki, Joris Van Campenhout, and Geert Van Steenberge. 2018. “Aerosol-Jet Printed Interconnects for 60-Gb/s CMOS Driver and Microring Modulator Transmitter Assembly.” IEEE PHOTONICS TECHNOLOGY LETTERS 30 (22): 1944–1947. doi:10.1109/lpt.2018.2873056.
- Vancouver
- 1.Elmogi A, Ramon H, Lambrecht J, Ossieur P, Torfs G, Missinne J, et al. Aerosol-Jet printed interconnects for 60-Gb/s CMOS driver and microring modulator transmitter assembly. IEEE PHOTONICS TECHNOLOGY LETTERS. 2018;30(22):1944–7.
- IEEE
- [1]A. Elmogi et al., “Aerosol-Jet printed interconnects for 60-Gb/s CMOS driver and microring modulator transmitter assembly,” IEEE PHOTONICS TECHNOLOGY LETTERS, vol. 30, no. 22, pp. 1944–1947, 2018.
@article{8581741,
abstract = {{We developed an aerosol-jet printing technique to realize an optical transmitter assembly of a microring modulator and a high-speed CMOS driver in which the bonding wires are replaced by aerosol-jet printed silver interconnects. First, the technology is characterized by printing coplanar waveguides (CPWs) test structures on glass and epoxy in order to fully investigate the electro-magnetic behavior of the aerosol-jet printed interconnects. The printed CPWs on glass and epoxy showed a low attenuation of 0.57 and 0.76 dB/mm at 50 GHz, respectively. Then, the aerosol-jet printed interconnects were benchmarked with conventional bonding wires while separately interconnecting the ring modulator without the CMOS driver. The measured reflection coefficient (S-11) of the aerosoljet printed interconnects showed an increase in a resonance frequency of 20 GHz compared with Al bonding wires. Furthermore, the optical transmitter was successfully demonstrated at 60 Gb/s and the measured optical eye diagrams were clearly open even after 2 km of standard single-mode fiber. An extinction ratio of 4.63 dB was achieved while applying a drive voltage of 1 V-pp.}},
author = {{Elmogi, Ahmed and Ramon, Hannes and Lambrecht, Joris and Ossieur, Peter and Torfs, Guy and Missinne, Jeroen and De Heyn, Peter and Ban, Yoojin and Pantouvaki, Marianna and Van Campenhout, Joris and Van Steenberge, Geert}},
issn = {{1041-1135}},
journal = {{IEEE PHOTONICS TECHNOLOGY LETTERS}},
keywords = {{Electrical and Electronic Engineering,Atomic and Molecular Physics,and Optics,Electronic,Optical and Magnetic Materials,Aerosol-jet,electrical interconnects,ring modulator,CMOS driver,coplanar,waveguide,DEVICES}},
language = {{eng}},
number = {{22}},
pages = {{1944--1947}},
publisher = {{Institute of Electrical and Electronics Engineers (IEEE)}},
title = {{Aerosol-Jet printed interconnects for 60-Gb/s CMOS driver and microring modulator transmitter assembly}},
url = {{http://doi.org/10.1109/lpt.2018.2873056}},
volume = {{30}},
year = {{2018}},
}
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