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Citation

Please use this url to cite or link to this publication:

MLA
Snyder, Bradley et al. “Packaging and Assembly Challenges for 50G Silicon Photonics Interposers.” 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). OSA, 2018. Print.
APA
Snyder, B., Mangal, N., Lepage, G., Balakrishnan, S., Sun, X., Pantano, N., Rakowski, M., et al. (2018). Packaging and assembly challenges for 50G silicon photonics interposers. 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). Presented at the Optical Fiber Communications Conference and Exposition (OFC), OSA.
Chicago author-date
Snyder, Bradley, Nivesh Mangal, Guy Lepage, Sadhishkumar Balakrishnan, Xiao Sun, Nicolas Pantano, Michal Rakowski, et al. 2018. “Packaging and Assembly Challenges for 50G Silicon Photonics Interposers.” In 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). OSA.
Chicago author-date (all authors)
Snyder, Bradley, Nivesh Mangal, Guy Lepage, Sadhishkumar Balakrishnan, Xiao Sun, Nicolas Pantano, Michal Rakowski, Lieve Bogaerts, Peter De Heyn, Peter Verheyen, Andy Miller, Marianna Pantouvaki, Philippe Absil, and Joris Van Campenhout. 2018. “Packaging and Assembly Challenges for 50G Silicon Photonics Interposers.” In 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). OSA.
Vancouver
1.
Snyder B, Mangal N, Lepage G, Balakrishnan S, Sun X, Pantano N, et al. Packaging and assembly challenges for 50G silicon photonics interposers. 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC). OSA; 2018.
IEEE
[1]
B. Snyder et al., “Packaging and assembly challenges for 50G silicon photonics interposers,” in 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC), San Diego, CA, 2018.
@inproceedings{8580799,
  author       = {Snyder, Bradley and Mangal, Nivesh and Lepage, Guy and Balakrishnan, Sadhishkumar and Sun, Xiao and Pantano, Nicolas and Rakowski, Michal and Bogaerts, Lieve and De Heyn, Peter and Verheyen, Peter and Miller, Andy and Pantouvaki, Marianna and Absil, Philippe and Van Campenhout, Joris},
  booktitle    = {2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)},
  isbn         = {9781943580385},
  language     = {eng},
  location     = {San Diego, CA},
  pages        = {3},
  publisher    = {OSA},
  title        = {Packaging and assembly challenges for 50G silicon photonics interposers},
  url          = {http://dx.doi.org/10.1364/ofc.2018.tu2a.3},
  year         = {2018},
}

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