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Integration of ball lens in through-package via to enable photonic chip-to-board coupling

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Chicago
Mangal, Nivesh, Jeroen Missinne, Joris Van Campenhout, Geert Van Steenberge, and Brad Snyder. 2018. “Integration of Ball Lens in Through-package via to Enable Photonic Chip-to-board Coupling.” In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1140–1145. IEEE.
APA
Mangal, Nivesh, Missinne, J., Van Campenhout, J., Van Steenberge, G., & Snyder, B. (2018). Integration of ball lens in through-package via to enable photonic chip-to-board coupling. 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (pp. 1140–1145). Presented at the 2018 IEEE 68th Electronic Components and Technology Conference, IEEE.
Vancouver
1.
Mangal N, Missinne J, Van Campenhout J, Van Steenberge G, Snyder B. Integration of ball lens in through-package via to enable photonic chip-to-board coupling. 2018 IEEE 68th Electronic Components and Technology Conference (ECTC). IEEE; 2018. p. 1140–5.
MLA
Mangal, Nivesh, Jeroen Missinne, Joris Van Campenhout, et al. “Integration of Ball Lens in Through-package via to Enable Photonic Chip-to-board Coupling.” 2018 IEEE 68th Electronic Components and Technology Conference (ECTC). IEEE, 2018. 1140–1145. Print.
@inproceedings{8580798,
  author       = {Mangal, Nivesh and Missinne, Jeroen and Van Campenhout, Joris and Van Steenberge, Geert and Snyder, Brad},
  booktitle    = {2018 IEEE 68th Electronic Components and Technology Conference (ECTC)},
  isbn         = {9781538649992},
  language     = {eng},
  location     = {California, United States of America},
  pages        = {1140--1145},
  publisher    = {IEEE},
  title        = {Integration of ball lens in through-package via to enable photonic chip-to-board coupling},
  url          = {http://dx.doi.org/10.1109/ectc.2018.00175},
  year         = {2018},
}

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