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Packaging silicon photonics with polymer waveguides for 3D electro-optical integration

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Citation

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Chicago
Mangal, Nivesh, Jeroen Missinne, Geert Van Steenberge, J. Van Campenhout, and B. Snyder. 2017. “Packaging Silicon Photonics with Polymer Waveguides for 3D Electro-optical Integration.” In 30TH ANNUAL CONFERENCE OF THE IEEE PHOTONICS SOCIETY (IPC) , 707–708. IEEE.
APA
Mangal, Nivesh, Missinne, J., Van Steenberge, G., Van Campenhout, J., & Snyder, B. (2017). Packaging silicon photonics with polymer waveguides for 3D electro-optical integration. 30TH ANNUAL CONFERENCE OF THE IEEE PHOTONICS SOCIETY (IPC) (pp. 707–708). Presented at the 30th Annual Conference of the IEEE-Photonics-Society (IPC) , IEEE.
Vancouver
1.
Mangal N, Missinne J, Van Steenberge G, Van Campenhout J, Snyder B. Packaging silicon photonics with polymer waveguides for 3D electro-optical integration. 30TH ANNUAL CONFERENCE OF THE IEEE PHOTONICS SOCIETY (IPC) . IEEE; 2017. p. 707–8.
MLA
Mangal, Nivesh, Jeroen Missinne, Geert Van Steenberge, et al. “Packaging Silicon Photonics with Polymer Waveguides for 3D Electro-optical Integration.” 30TH ANNUAL CONFERENCE OF THE IEEE PHOTONICS SOCIETY (IPC) . IEEE, 2017. 707–708. Print.
@inproceedings{8580797,
  author       = {Mangal, Nivesh and Missinne, Jeroen and Van Steenberge, Geert and Van Campenhout, J. and Snyder, B.},
  booktitle    = {30TH ANNUAL CONFERENCE OF THE IEEE PHOTONICS SOCIETY (IPC) },
  isbn         = {9781509065783},
  issn         = {2374-0140 },
  language     = {eng},
  location     = {Orlando, FL },
  pages        = {707--708},
  publisher    = {IEEE},
  title        = {Packaging silicon photonics with polymer waveguides for 3D electro-optical integration},
  url          = {http://dx.doi.org/10.1109/ipcon.2017.8116289},
  year         = {2017},
}

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