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Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration

Ahmed Elmogi UGent, Wouter Soenen UGent, Hannes Ramon UGent, Xin Yin UGent, Jeroen Missinne UGent, Silvia Spiga, Markus-Christian Amann, Ashwyn Srinivasan, Peter De Heyn, Joris Van Campenhout, et al. (2018) JOURNAL OF LIGHTWAVE TECHNOLOGY. 36(16). p.3528-3533
abstract
We demonstrate a flexible face-up 2.5 D packaging technique for a hybrid electro-photonic integration. The process is based on an aerosol-jet technology to print the high-speed electrical interconnects between electronic and photonic chips as a potential alternative for the traditional bonding wires. The technology is realized by creating a transparent mechanical polymer support to bridge the gap between the photonic and electronic chips and subsequently printing the electrical interconnects on top. First, the daisy-chain test chips were used to prove the functionality of the technology by printing the electrical interconnects between the test chips. Then, a standard 85 ° C/85 RH test was performed to investigate the reliability of the printed interconnects and no failure or degradation was observed over 700 h. Afterwards, the technology was successfully applied on functional chips. An optical transmitter based on vertical cavity surface emitting lasers (VCSELs) was demonstrated at 50 Gb/s by printing 200-μm-long high-speed silver interconnects between a 4-channel SiGe BiCMOS driver and four VCSELs. In addition, the technology showed the potential to interconnect silicon photonics chips. An assembly of an electro-absorption modulator (EAM) and a CMOS driver was successfully demonstrated. Clear open eye diagrams were obtained at 40, 50, and 56 Gb/s for the EAM-driver assembly even after 2 km of a standard single-mode fiber
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
keyword
Aerosol-jet printing (AJP), electro-photonic integration, electrical interconnects, VCSEL, CMOS driver, electroabsorption modulator (EAM)
journal title
JOURNAL OF LIGHTWAVE TECHNOLOGY
volume
36
issue
16
pages
6 pages
publisher
Institute of Electrical and Electronics Engineers (IEEE)
ISSN
0733-8724
1558-2213
DOI
10.1109/jlt.2018.2848699
language
English
UGent publication?
yes
classification
U
copyright statement
I have transferred the copyright for this publication to the publisher
id
8568855
handle
http://hdl.handle.net/1854/LU-8568855
date created
2018-07-09 09:29:22
date last changed
2018-07-09 12:16:46
@article{8568855,
  abstract     = {We demonstrate a flexible face-up 2.5 D packaging technique for a hybrid electro-photonic integration. The process is based on an aerosol-jet technology to print the high-speed electrical interconnects between electronic and photonic chips as a potential alternative for the traditional bonding wires. The technology is realized by creating a transparent mechanical polymer support to bridge the gap between the photonic and electronic chips and subsequently printing the electrical interconnects on top. First, the daisy-chain test chips were used to prove the functionality of the technology by printing the electrical interconnects between the test chips. Then, a standard 85 {\textdegree} C/85 RH test was performed to investigate the reliability of the printed interconnects and no failure or degradation was observed over 700 h. Afterwards, the technology was successfully applied on functional chips. An optical transmitter based on vertical cavity surface emitting lasers (VCSELs) was demonstrated at 50 Gb/s by printing 200-\ensuremath{\mu}m-long high-speed silver interconnects between a 4-channel SiGe BiCMOS driver and four VCSELs. In addition, the technology showed the potential to interconnect silicon photonics chips. An assembly of an electro-absorption modulator (EAM) and a CMOS driver was successfully demonstrated. Clear open eye diagrams were obtained at 40, 50, and 56 Gb/s for the EAM-driver assembly even after 2 km of a standard single-mode fiber},
  author       = {Elmogi, Ahmed and Soenen, Wouter and Ramon, Hannes and Yin, Xin and Missinne, Jeroen and Spiga, Silvia and Amann, Markus-Christian and Srinivasan, Ashwyn and De Heyn, Peter and Van Campenhout, Joris and Bauwelinck, Johan and Van Steenberge, Geert},
  issn         = {0733-8724},
  journal      = { JOURNAL OF LIGHTWAVE TECHNOLOGY},
  keyword      = {Aerosol-jet printing (AJP),electro-photonic integration,electrical interconnects,VCSEL,CMOS driver,electroabsorption modulator (EAM)},
  language     = {eng},
  number       = {16},
  pages        = {3528--3533},
  publisher    = {Institute of Electrical and Electronics Engineers (IEEE)},
  title        = {Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration},
  url          = {http://dx.doi.org/10.1109/jlt.2018.2848699},
  volume       = {36},
  year         = {2018},
}

Chicago
Elmogi, Ahmed, Wouter Soenen, Hannes Ramon, Xin Yin, Jeroen Missinne, Silvia Spiga, Markus-Christian Amann, et al. 2018. “Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration.” Journal of Lightwave Technology 36 (16): 3528–3533.
APA
Elmogi, A., Soenen, W., Ramon, H., Yin, X., Missinne, J., Spiga, S., Amann, M.-C., et al. (2018). Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration. JOURNAL OF LIGHTWAVE TECHNOLOGY, 36(16), 3528–3533.
Vancouver
1.
Elmogi A, Soenen W, Ramon H, Yin X, Missinne J, Spiga S, et al. Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration. JOURNAL OF LIGHTWAVE TECHNOLOGY. Institute of Electrical and Electronics Engineers (IEEE); 2018;36(16):3528–33.
MLA
Elmogi, Ahmed, Wouter Soenen, Hannes Ramon, et al. “Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration.” JOURNAL OF LIGHTWAVE TECHNOLOGY 36.16 (2018): 3528–3533. Print.