Aerosol-jet printed interconnects for 2.5 D electronic and photonic integration
- Author
- Ahmed Elmogi, Wouter Soenen (UGent) , Hannes Ramon, Xin Yin (UGent) , Jeroen Missinne (UGent) , Silvia Spiga, Markus-Christian Amann, Ashwyn Srinivasan, Peter De Heyn, Joris Van Campenhout, Johan Bauwelinck (UGent) and Geert Van Steenberge (UGent)
- Organization
- Abstract
- We demonstrate a flexible face-up 2.5 D packaging technique for a hybrid electro-photonic integration. The process is based on an aerosol-jet technology to print the high-speed electrical interconnects between electronic and photonic chips as a potential alternative for the traditional bonding wires. The technology is realized by creating a transparent mechanical polymer support to bridge the gap between the photonic and electronic chips and subsequently printing the electrical interconnects on top. First, the daisy-chain test chips were used to prove the functionality of the technology by printing the electrical interconnects between the test chips. Then, a standard 85 ° C/85 RH test was performed to investigate the reliability of the printed interconnects and no failure or degradation was observed over 700 h. Afterwards, the technology was successfully applied on functional chips. An optical transmitter based on vertical cavity surface emitting lasers (VCSELs) was demonstrated at 50 Gb/s by printing 200-μm-long high-speed silver interconnects between a 4-channel SiGe BiCMOS driver and four VCSELs. In addition, the technology showed the potential to interconnect silicon photonics chips. An assembly of an electro-absorption modulator (EAM) and a CMOS driver was successfully demonstrated. Clear open eye diagrams were obtained at 40, 50, and 56 Gb/s for the EAM-driver assembly even after 2 km of a standard single-mode fiber
- Keywords
- Aerosol-jet printing (AJP), electro-photonic integration, electrical interconnects, VCSEL, CMOS driver, electroabsorption modulator (EAM)
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-8568855
- MLA
- Elmogi, Ahmed, et al. “Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration.” JOURNAL OF LIGHTWAVE TECHNOLOGY, vol. 36, no. 16, Institute of Electrical and Electronics Engineers (IEEE), 2018, pp. 3528–33, doi:10.1109/jlt.2018.2848699.
- APA
- Elmogi, A., Soenen, W., Ramon, H., Yin, X., Missinne, J., Spiga, S., … Van Steenberge, G. (2018). Aerosol-jet printed interconnects for 2.5 D electronic and photonic integration. JOURNAL OF LIGHTWAVE TECHNOLOGY, 36(16), 3528–3533. https://doi.org/10.1109/jlt.2018.2848699
- Chicago author-date
- Elmogi, Ahmed, Wouter Soenen, Hannes Ramon, Xin Yin, Jeroen Missinne, Silvia Spiga, Markus-Christian Amann, et al. 2018. “Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration.” JOURNAL OF LIGHTWAVE TECHNOLOGY 36 (16): 3528–33. https://doi.org/10.1109/jlt.2018.2848699.
- Chicago author-date (all authors)
- Elmogi, Ahmed, Wouter Soenen, Hannes Ramon, Xin Yin, Jeroen Missinne, Silvia Spiga, Markus-Christian Amann, Ashwyn Srinivasan, Peter De Heyn, Joris Van Campenhout, Johan Bauwelinck, and Geert Van Steenberge. 2018. “Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration.” JOURNAL OF LIGHTWAVE TECHNOLOGY 36 (16): 3528–3533. doi:10.1109/jlt.2018.2848699.
- Vancouver
- 1.Elmogi A, Soenen W, Ramon H, Yin X, Missinne J, Spiga S, et al. Aerosol-jet printed interconnects for 2.5 D electronic and photonic integration. JOURNAL OF LIGHTWAVE TECHNOLOGY. 2018;36(16):3528–33.
- IEEE
- [1]A. Elmogi et al., “Aerosol-jet printed interconnects for 2.5 D electronic and photonic integration,” JOURNAL OF LIGHTWAVE TECHNOLOGY, vol. 36, no. 16, pp. 3528–3533, 2018.
@article{8568855,
abstract = {{We demonstrate a flexible face-up 2.5 D packaging technique for a hybrid electro-photonic integration. The process is based on an aerosol-jet technology to print the high-speed electrical interconnects between electronic and photonic chips as a potential alternative for the traditional bonding wires. The technology is realized by creating a transparent mechanical polymer support to bridge the gap between the photonic and electronic chips and subsequently printing the electrical interconnects on top. First, the daisy-chain test chips were used to prove the functionality of the technology by printing the electrical interconnects between the test chips. Then, a standard 85 ° C/85 RH test was performed to investigate the reliability of the printed interconnects and no failure or degradation was observed over 700 h. Afterwards, the technology was successfully applied on functional chips. An optical transmitter based on vertical cavity surface emitting lasers (VCSELs) was demonstrated at 50 Gb/s by printing 200-μm-long high-speed silver interconnects between a 4-channel SiGe BiCMOS driver and four VCSELs. In addition, the technology showed the potential to interconnect silicon photonics chips. An assembly of an electro-absorption modulator (EAM) and a CMOS driver was successfully demonstrated. Clear open eye diagrams were obtained at 40, 50, and 56 Gb/s for the EAM-driver assembly even after 2 km of a standard single-mode fiber}},
author = {{Elmogi, Ahmed and Soenen, Wouter and Ramon, Hannes and Yin, Xin and Missinne, Jeroen and Spiga, Silvia and Amann, Markus-Christian and Srinivasan, Ashwyn and De Heyn, Peter and Van Campenhout, Joris and Bauwelinck, Johan and Van Steenberge, Geert}},
issn = {{0733-8724}},
journal = {{JOURNAL OF LIGHTWAVE TECHNOLOGY}},
keywords = {{Aerosol-jet printing (AJP),electro-photonic integration,electrical interconnects,VCSEL,CMOS driver,electroabsorption modulator (EAM)}},
language = {{eng}},
number = {{16}},
pages = {{3528--3533}},
publisher = {{Institute of Electrical and Electronics Engineers (IEEE)}},
title = {{Aerosol-jet printed interconnects for 2.5 D electronic and photonic integration}},
url = {{http://doi.org/10.1109/jlt.2018.2848699}},
volume = {{36}},
year = {{2018}},
}
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