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Oxidation barrier of Cu and Fe powder by atomic layer deposition

(2018) SURFACE & COATINGS TECHNOLOGY. 349. p.1032-1041
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Abstract
Atomic Layer Deposition (ALD) is a vapor based technique which allows to deposit uniform, conformal films with a thickness control at the atomic scale. In this research, Al2O3 coatings were deposited on micrometer-sized Fe and Cu powder (particles) using the thermal trimethylaluminum (TMA)/water (H2O) process in a rotary pump-type ALD reactor. Rotation of the powder during deposition was required to obtain a pinhole-free AID coating. The protective nature of the coating was evaluated by quantifying its effectiveness in protecting the metal particles during oxidative annealing treatments. The Al2O3 coated powders were annealed in ambient air while in-situ thermogravimetric analysis (TGA) and in-situ x-ray diffraction (XRD) data were acquired. The thermal stability of a series of Cu and Fe powder with different Al2O3 thicknesses were determined with TGA. In both samples a dear shift in oxidation temperature is visible. For Cu and Fe powder coated with 25 nor Al2O3, we observed an increase of the oxidation temperature with 300-400 degrees C. For the Cu powder a thin film of only 8 nm is required to obtain an initial increase in oxidation temperature of 200 degrees C. In contrast, for Fe powder a thicker coating of 25 nm is required. In both cases, the oxidation temperature increases with increasing thickness of the Al2O3 coating. These results illustrate that the Al2O3 thin film, deposited by the thermal ALD process (TMA/H2O) can be an efficient and pinhole-free barrier layer for micrometer-sized powder particles, provided that the powder is properly agitated during the process to ensure sufficient vapor-solid interaction.
Keywords
Atomic Layer Deposition, ALD, Powder, Oxdidation barrier, X-RAY-DIFFRACTION, THIN-FILMS, RESISTANCE, PARTICLES, COATINGS

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Chicago
Cremers, Véronique, Geert Rampelberg, Ahmed Barhoum, Perry Walters, Nathalie Claes, Thais Milagres de Oliveira, Guy Van Assche, Sara Bals, Jolien Dendooven, and Christophe Detavernier. 2018. “Oxidation Barrier of Cu and Fe Powder by Atomic Layer Deposition.” Surface & Coatings Technology 349: 1032–1041.
APA
Cremers, V., Rampelberg, G., Barhoum, A., Walters, P., Claes, N., de Oliveira, T. M., Van Assche, G., et al. (2018). Oxidation barrier of Cu and Fe powder by atomic layer deposition. SURFACE & COATINGS TECHNOLOGY, 349, 1032–1041.
Vancouver
1.
Cremers V, Rampelberg G, Barhoum A, Walters P, Claes N, de Oliveira TM, et al. Oxidation barrier of Cu and Fe powder by atomic layer deposition. SURFACE & COATINGS TECHNOLOGY. 2018;349:1032–41.
MLA
Cremers, Véronique et al. “Oxidation Barrier of Cu and Fe Powder by Atomic Layer Deposition.” SURFACE & COATINGS TECHNOLOGY 349 (2018): 1032–1041. Print.
@article{8568849,
  abstract     = {Atomic Layer Deposition (ALD) is a vapor based technique which allows to deposit uniform, conformal films with a thickness control at the atomic scale. In this research, Al2O3 coatings were deposited on micrometer-sized Fe and Cu powder (particles) using the thermal trimethylaluminum (TMA)/water (H2O) process in a rotary pump-type ALD reactor. Rotation of the powder during deposition was required to obtain a pinhole-free AID coating. The protective nature of the coating was evaluated by quantifying its effectiveness in protecting the metal particles during oxidative annealing treatments. The Al2O3 coated powders were annealed in ambient air while in-situ thermogravimetric analysis (TGA) and in-situ x-ray diffraction (XRD) data were acquired. The thermal stability of a series of Cu and Fe powder with different Al2O3 thicknesses were determined with TGA. In both samples a dear shift in oxidation temperature is visible. For Cu and Fe powder coated with 25 nor Al2O3, we observed an increase of the oxidation temperature with 300-400 degrees C. For the Cu powder a thin film of only 8 nm is required to obtain an initial increase in oxidation temperature of 200 degrees C. In contrast, for Fe powder a thicker coating of 25 nm is required. In both cases, the oxidation temperature increases with increasing thickness of the Al2O3 coating. These results illustrate that the Al2O3 thin film, deposited by the thermal ALD process (TMA/H2O) can be an efficient and pinhole-free barrier layer for micrometer-sized powder particles, provided that the powder is properly agitated during the process to ensure sufficient vapor-solid interaction.},
  author       = {Cremers, V{\'e}ronique and Rampelberg, Geert and Barhoum, Ahmed and Walters, Perry and Claes, Nathalie and de Oliveira, Thais Milagres and Van Assche, Guy and Bals, Sara and Dendooven, Jolien and Detavernier, Christophe},
  issn         = {0257-8972},
  journal      = {SURFACE \& COATINGS TECHNOLOGY},
  language     = {eng},
  pages        = {1032--1041},
  title        = {Oxidation barrier of Cu and Fe powder by atomic layer deposition},
  url          = {http://dx.doi.org/10.1016/j.surfcoat.2018.06.048},
  volume       = {349},
  year         = {2018},
}

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