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Substrate-independent microwave components in substrate integrated waveguide technology for high-performance smart surfaces

Kamil Yavuz Kapusuz (UGent) , Sam Lemey (UGent) and Hendrik Rogier (UGent)
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Abstract
Although all existing air-filled substrate integrated waveguide (AFSIW) topologies yield a substrate-independent electrical performance, they rely on dedicated, expensive, laminates to form air-filled regions that contain the electromagnetic fields. This paper proposes a novel substrate-independent AFSIW manufacturing technology, enabling straightforward integration of high-performance microwave components into a wide range of general-purpose commercially available surface materials by means of standard additive (3-D printing) or subtractive (computer numerically controlled milling/laser cutting) manufacturing processes. First, an analytical formula is derived for the effective permittivity and loss tangent of the AFSIW waveguide. This allows the designer to reduce substrate losses to levels typically encountered in high-frequency laminates. Then, several microwave components are designed and fabricated. Measurements of multiple AFSIW waveguides and a four-way power divider/combiner, both relying on a new coaxial-to-air-filled SIW transition, prove that this novel approach yields microwave components suitable for direct integration into everyday surfaces, with low insertion loss, and excellent matching and isolation over the entire [5.15-5.85] GHz band. Hence, this innovative approach paves the way for a new generation of cost-effective, high-performance, and invisibly integrated smart surface systems that efficiently exploit the area and the materials available in everyday objects.
Keywords
MILLIMETER-WAVE, CIRCUITS, ANTENNAS, FABRICATION, Additive manufacturing, air-filled substrate integrated waveguide, (AFSIW), AFSIW transition, loss reduction, power divider, smart surface, subtractive manufacturing

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Citation

Please use this url to cite or link to this publication:

Chicago
Kapusuz, Kamil Yavuz, Sam Lemey, and Hendrik Rogier. 2018. “Substrate-independent Microwave Components in Substrate Integrated Waveguide Technology for High-performance Smart Surfaces.” Ieee Transactions on Microwave Theory and Techniques 66 (6): 3036–3047.
APA
Kapusuz, K. Y., Lemey, S., & Rogier, H. (2018). Substrate-independent microwave components in substrate integrated waveguide technology for high-performance smart surfaces. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 66(6), 3036–3047.
Vancouver
1.
Kapusuz KY, Lemey S, Rogier H. Substrate-independent microwave components in substrate integrated waveguide technology for high-performance smart surfaces. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. Piscataway: Ieee-inst Electrical Electronics Engineers Inc; 2018;66(6):3036–47.
MLA
Kapusuz, Kamil Yavuz, Sam Lemey, and Hendrik Rogier. “Substrate-independent Microwave Components in Substrate Integrated Waveguide Technology for High-performance Smart Surfaces.” IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES 66.6 (2018): 3036–3047. Print.
@article{8567116,
  abstract     = {Although all existing air-filled substrate integrated waveguide (AFSIW) topologies yield a substrate-independent electrical performance, they rely on dedicated, expensive, laminates to form air-filled regions that contain the electromagnetic fields. This paper proposes a novel substrate-independent AFSIW manufacturing technology, enabling straightforward integration of high-performance microwave components into a wide range of general-purpose commercially available surface materials by means of standard additive (3-D printing) or subtractive (computer numerically controlled milling/laser cutting) manufacturing processes. First, an analytical formula is derived for the effective permittivity and loss tangent of the AFSIW waveguide. This allows the designer to reduce substrate losses to levels typically encountered in high-frequency laminates. Then, several microwave components are designed and fabricated. Measurements of multiple AFSIW waveguides and a four-way power divider/combiner, both relying on a new coaxial-to-air-filled SIW transition, prove that this novel approach yields microwave components suitable for direct integration into everyday surfaces, with low insertion loss, and excellent matching and isolation over the entire [5.15-5.85] GHz band. Hence, this innovative approach paves the way for a new generation of cost-effective, high-performance, and invisibly integrated smart surface systems that efficiently exploit the area and the materials available in everyday objects.},
  author       = {Kapusuz, Kamil Yavuz and Lemey, Sam and Rogier, Hendrik},
  issn         = {0018-9480},
  journal      = {IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES},
  language     = {eng},
  number       = {6},
  pages        = {3036--3047},
  publisher    = {Ieee-inst Electrical Electronics Engineers Inc},
  title        = {Substrate-independent microwave components in substrate integrated waveguide technology for high-performance smart surfaces},
  url          = {http://dx.doi.org/10.1109/TMTT.2018.2823319},
  volume       = {66},
  year         = {2018},
}

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