Advanced search
1 file | 585.24 KB Add to list

Rigorous full-wave resistance and inductance computation of 3-D interconnects

Martijn Huynen (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)
Author
Organization
Abstract
A full-wave technique to rigorously extract the resistance and the inductance of 3-D interconnects is proposed. A novel and full 3-D differential surface admittance operator and a boundary integral equation approach are combined in a circuit interpretation which provides a simple way to evaluate the characteristics of the interconnects. The method is accurate for various examples over a broad frequency range, thus conforming its appositeness for the modeling of 3-D interconnects.
Keywords
SURFACE ADMITTANCE OPERATOR, 3-D surface admittance, boundary integral equation (BIE), interconnect, modeling

Downloads

  • (...).pdf
    • full text
    • |
    • UGent only
    • |
    • PDF
    • |
    • 585.24 KB

Citation

Please use this url to cite or link to this publication:

MLA
Huynen, Martijn, et al. “Rigorous Full-Wave Resistance and Inductance Computation of 3-D Interconnects.” IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, vol. 28, no. 6, Ieee-inst Electrical Electronics Engineers Inc, 2018, pp. 455–57, doi:10.1109/LMWC.2018.2825652.
APA
Huynen, M., De Zutter, D., & Vande Ginste, D. (2018). Rigorous full-wave resistance and inductance computation of 3-D interconnects. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 28(6), 455–457. https://doi.org/10.1109/LMWC.2018.2825652
Chicago author-date
Huynen, Martijn, Daniël De Zutter, and Dries Vande Ginste. 2018. “Rigorous Full-Wave Resistance and Inductance Computation of 3-D Interconnects.” IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS 28 (6): 455–57. https://doi.org/10.1109/LMWC.2018.2825652.
Chicago author-date (all authors)
Huynen, Martijn, Daniël De Zutter, and Dries Vande Ginste. 2018. “Rigorous Full-Wave Resistance and Inductance Computation of 3-D Interconnects.” IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS 28 (6): 455–457. doi:10.1109/LMWC.2018.2825652.
Vancouver
1.
Huynen M, De Zutter D, Vande Ginste D. Rigorous full-wave resistance and inductance computation of 3-D interconnects. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS. 2018;28(6):455–7.
IEEE
[1]
M. Huynen, D. De Zutter, and D. Vande Ginste, “Rigorous full-wave resistance and inductance computation of 3-D interconnects,” IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, vol. 28, no. 6, pp. 455–457, 2018.
@article{8566053,
  abstract     = {{A full-wave technique to rigorously extract the resistance and the inductance of 3-D interconnects is proposed. A novel and full 3-D differential surface admittance operator and a boundary integral equation approach are combined in a circuit interpretation which provides a simple way to evaluate the characteristics of the interconnects. The method is accurate for various examples over a broad frequency range, thus conforming its appositeness for the modeling of 3-D interconnects.}},
  author       = {{Huynen, Martijn and De Zutter, Daniël and Vande Ginste, Dries}},
  issn         = {{1531-1309}},
  journal      = {{IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS}},
  keywords     = {{SURFACE ADMITTANCE OPERATOR,3-D surface admittance,boundary integral equation (BIE),interconnect,modeling}},
  language     = {{eng}},
  number       = {{6}},
  pages        = {{455--457}},
  publisher    = {{Ieee-inst Electrical Electronics Engineers Inc}},
  title        = {{Rigorous full-wave resistance and inductance computation of 3-D interconnects}},
  url          = {{http://dx.doi.org/10.1109/LMWC.2018.2825652}},
  volume       = {{28}},
  year         = {{2018}},
}

Altmetric
View in Altmetric
Web of Science
Times cited: