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Transceivers for 400G based on hybrid integrated thick SOI and III/V chips

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Citation

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Chicago
Aalto, T., M. Harjanne, T. Vehmas, M. Karppinen, A. Sitomaniemi, A. Malacarne, C. Neumeyr, and Johan Bauwelinck. 2017. “Transceivers for 400G Based on Hybrid Integrated Thick SOI and III/V Chips .” In 43RD EUROPEAN CONFERENCE ON OPTICAL COMMUNICATION (ECOC 2017) , 1–3.
APA
Aalto, T., Harjanne, M., Vehmas, T., Karppinen, M., Sitomaniemi, A., Malacarne, A., Neumeyr, C., et al. (2017). Transceivers for 400G based on hybrid integrated thick SOI and III/V chips . 43RD EUROPEAN CONFERENCE ON OPTICAL COMMUNICATION (ECOC 2017) (pp. 1–3). Presented at the 43rd European Conference on Optical Communication (ECOC).
Vancouver
1.
Aalto T, Harjanne M, Vehmas T, Karppinen M, Sitomaniemi A, Malacarne A, et al. Transceivers for 400G based on hybrid integrated thick SOI and III/V chips . 43RD EUROPEAN CONFERENCE ON OPTICAL COMMUNICATION (ECOC 2017) . 2017. p. 1–3.
MLA
Aalto, T., M. Harjanne, T. Vehmas, et al. “Transceivers for 400G Based on Hybrid Integrated Thick SOI and III/V Chips .” 43RD EUROPEAN CONFERENCE ON OPTICAL COMMUNICATION (ECOC 2017) . 2017. 1–3. Print.
@inproceedings{8542195,
  author       = {Aalto, T. and Harjanne, M. and Vehmas, T. and Karppinen, M. and Sitomaniemi, A. and Malacarne, A. and Neumeyr, C. and Bauwelinck, Johan},
  booktitle    = {43RD EUROPEAN CONFERENCE ON OPTICAL COMMUNICATION (ECOC 2017) },
  isbn         = {978-1-5386-5624-2},
  keyword      = {IBCN},
  language     = {eng},
  location     = {Gothenburg, Sweden},
  pages        = {1--3},
  title        = {Transceivers for 400G based on hybrid integrated thick SOI and III/V chips },
  year         = {2017},
}

Web of Science
Times cited: