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Flexible hybrid integration of photonic and electronic chips using aerosol-jet printing

(2017) p.82-85
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Citation

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Chicago
Elmogi, Ahmed, Wouter Soenen, Erwin Bosman, Jeroen Missinne, Silvia Spiga, M.-C. Amann, Johan Bauwelinck, and Geert Van Steenberge. 2017. “Flexible Hybrid Integration of Photonic and Electronic Chips Using Aerosol-jet Printing.” In , 82–85.
APA
Elmogi, A., Soenen, W., Bosman, E., Missinne, J., Spiga, S., Amann, M.-C., Bauwelinck, J., et al. (2017). Flexible hybrid integration of photonic and electronic chips using aerosol-jet printing (pp. 82–85). Presented at the 22nd  Annual Symposium of the IEEE Photonics Society Benelux Chapter.
Vancouver
1.
Elmogi A, Soenen W, Bosman E, Missinne J, Spiga S, Amann M-C, et al. Flexible hybrid integration of photonic and electronic chips using aerosol-jet printing. 2017. p. 82–5.
MLA
Elmogi, Ahmed, Wouter Soenen, Erwin Bosman, et al. “Flexible Hybrid Integration of Photonic and Electronic Chips Using Aerosol-jet Printing.” 2017. 82–85. Print.
@inproceedings{8541770,
  author       = {Elmogi, Ahmed and Soenen, Wouter and Bosman, Erwin and Missinne, Jeroen and Spiga, Silvia and Amann, M.-C. and Bauwelinck, Johan and Van Steenberge, Geert},
  language     = {eng},
  location     = {Delft, the Netherlands},
  pages        = {82--85},
  title        = {Flexible hybrid integration of photonic and electronic chips using aerosol-jet printing},
  year         = {2017},
}