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Four-point bending cycling : the alternative for thermal cycling solder fatigue testing of electronic components

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Keywords
Thermal cycling, Solder joint fatigue testing, Bending cycling, Chip Scale Packages, Life time prediction

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MLA
Vandevelde, Bart, et al. “Four-Point Bending Cycling : The Alternative for Thermal Cycling Solder Fatigue Testing of Electronic Components.” MICROELECTRONICS RELIABILITY, vol. 74, 2017, pp. 131–35.
APA
Vandevelde, B., Vanhee, F., Pissoort, D., Degrendele, L., De Baets, J., Allaert, B., … Willems, G. (2017). Four-point bending cycling : the alternative for thermal cycling solder fatigue testing of electronic components. MICROELECTRONICS RELIABILITY, 74, 131–135.
Chicago author-date
Vandevelde, Bart, Filip Vanhee, Davy Pissoort, Lieven Degrendele, Johan De Baets, Bart Allaert, Ralph Lauwaert, Franco Zanon, Riet Labie, and Geert Willems. 2017. “Four-Point Bending Cycling : The Alternative for Thermal Cycling Solder Fatigue Testing of Electronic Components.” MICROELECTRONICS RELIABILITY 74: 131–35.
Chicago author-date (all authors)
Vandevelde, Bart, Filip Vanhee, Davy Pissoort, Lieven Degrendele, Johan De Baets, Bart Allaert, Ralph Lauwaert, Franco Zanon, Riet Labie, and Geert Willems. 2017. “Four-Point Bending Cycling : The Alternative for Thermal Cycling Solder Fatigue Testing of Electronic Components.” MICROELECTRONICS RELIABILITY 74: 131–135.
Vancouver
1.
Vandevelde B, Vanhee F, Pissoort D, Degrendele L, De Baets J, Allaert B, et al. Four-point bending cycling : the alternative for thermal cycling solder fatigue testing of electronic components. MICROELECTRONICS RELIABILITY. 2017;74:131–5.
IEEE
[1]
B. Vandevelde et al., “Four-point bending cycling : the alternative for thermal cycling solder fatigue testing of electronic components,” MICROELECTRONICS RELIABILITY, vol. 74, pp. 131–135, 2017.
@article{8538294,
  author       = {Vandevelde, Bart and Vanhee, Filip and Pissoort, Davy and Degrendele, Lieven and De Baets, Johan and Allaert, Bart and Lauwaert, Ralph and Zanon, Franco and Labie, Riet and Willems, Geert},
  issn         = {0026-2714},
  journal      = {MICROELECTRONICS RELIABILITY},
  keywords     = {Thermal cycling,Solder joint fatigue testing,Bending cycling,Chip Scale Packages,Life time prediction},
  language     = {eng},
  location     = {Montpellier, FRANCE},
  pages        = {131--135},
  title        = {Four-point bending cycling : the alternative for thermal cycling solder fatigue testing of electronic components},
  url          = {http://dx.doi.org/10.1016/j.microrel.2017.04.008},
  volume       = {74},
  year         = {2017},
}

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