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Local passivation of metals at grain boundaries : in situ scanning tunneling microscopy study on copper

(2016) CORROSION SCIENCE. 111. p.659-666
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Abstract
Passivation at grain boundaries was investigated on copper with Electrochemical Scanning Tunneling Microscopy. The depth in intergranular regions was measured and its variation was discussed in terms of dissolution or passive film formation. The Cu(I) passive film is found to be thicker at grain boundaries than on grains but with a similar stoichiometry. A thicker Cu(l) passive film is observed at random grain boundaries than at coherent twins. No metal is preferentially consumed at grain boundaries by transient dissolution during Cu(I) passivation. Comprehensive comparison with Cu(I)/Cu(II) passivation shows that transient dissolution is a revelator of the grain boundary-type dependent behavior. (C) 2016 Elsevier Ltd. All rights reserved.
Keywords
0.1 M NAOH, ANODIC-OXIDATION, INITIAL-STAGES, INTERGRANULAR CORROSION, CRYSTALLOGRAPHIC ORIENTATION, ALKALINE-SOLUTIONS, POLYCRYSTALLINE, COPPER, RAMAN-SPECTROSCOPY, AQUEOUS-SOLUTIONS, SURFACE-STRUCTURE, Copper, AFM, Intergranular corrosion, Passive films

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Chicago
Chen, Hui, Mohamed Bettayeb, Vincent Maurice, Lorena H. Klein, Linsey Lapeire, Kim Verbeken, Herman Terryn, and Philippe Marcus. 2016. “Local Passivation of Metals at Grain Boundaries : in Situ Scanning Tunneling Microscopy Study on Copper.” Corrosion Science 111: 659–666.
APA
Chen, Hui, Bettayeb, M., Maurice, V., Klein, L. H., Lapeire, L., Verbeken, K., Terryn, H., et al. (2016). Local passivation of metals at grain boundaries : in situ scanning tunneling microscopy study on copper. CORROSION SCIENCE, 111, 659–666.
Vancouver
1.
Chen H, Bettayeb M, Maurice V, Klein LH, Lapeire L, Verbeken K, et al. Local passivation of metals at grain boundaries : in situ scanning tunneling microscopy study on copper. CORROSION SCIENCE. Oxford: Pergamon-elsevier Science Ltd; 2016;111:659–66.
MLA
Chen, Hui, Mohamed Bettayeb, Vincent Maurice, et al. “Local Passivation of Metals at Grain Boundaries : in Situ Scanning Tunneling Microscopy Study on Copper.” CORROSION SCIENCE 111 (2016): 659–666. Print.
@article{8537202,
  abstract     = {Passivation at grain boundaries was investigated on copper with Electrochemical Scanning Tunneling Microscopy. The depth in intergranular regions was measured and its variation was discussed in terms of dissolution or passive film formation. The Cu(I) passive film is found to be thicker at grain boundaries than on grains but with a similar stoichiometry. A thicker Cu(l) passive film is observed at random grain boundaries than at coherent twins. No metal is preferentially consumed at grain boundaries by transient dissolution during Cu(I) passivation. Comprehensive comparison with Cu(I)/Cu(II) passivation shows that transient dissolution is a revelator of the grain boundary-type dependent behavior. (C) 2016 Elsevier Ltd. All rights reserved.},
  author       = {Chen, Hui and Bettayeb, Mohamed and Maurice, Vincent and Klein, Lorena H. and Lapeire, Linsey and Verbeken, Kim and Terryn, Herman and Marcus, Philippe},
  issn         = {0010-938X},
  journal      = {CORROSION SCIENCE},
  keyword      = {0.1 M NAOH,ANODIC-OXIDATION,INITIAL-STAGES,INTERGRANULAR CORROSION,CRYSTALLOGRAPHIC ORIENTATION,ALKALINE-SOLUTIONS,POLYCRYSTALLINE,COPPER,RAMAN-SPECTROSCOPY,AQUEOUS-SOLUTIONS,SURFACE-STRUCTURE,Copper,AFM,Intergranular corrosion,Passive films},
  language     = {eng},
  pages        = {659--666},
  publisher    = {Pergamon-elsevier Science Ltd},
  title        = {Local passivation of metals at grain boundaries : in situ scanning tunneling microscopy study on copper},
  url          = {http://dx.doi.org/10.1016/j.corsci.2016.04.013},
  volume       = {111},
  year         = {2016},
}

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