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Local passivation of metals at grain boundaries : in situ scanning tunneling microscopy study on copper

Hui Chen, Mohamed Bettayeb, Vincent Maurice, Lorena H. Klein, Linsey Lapeire UGent, Kim Verbeken UGent, Herman Terryn and Philippe Marcus (2016) CORROSION SCIENCE. 111. p.659-666
abstract
Passivation at grain boundaries was investigated on copper with Electrochemical Scanning Tunneling Microscopy. The depth in intergranular regions was measured and its variation was discussed in terms of dissolution or passive film formation. The Cu(I) passive film is found to be thicker at grain boundaries than on grains but with a similar stoichiometry. A thicker Cu(l) passive film is observed at random grain boundaries than at coherent twins. No metal is preferentially consumed at grain boundaries by transient dissolution during Cu(I) passivation. Comprehensive comparison with Cu(I)/Cu(II) passivation shows that transient dissolution is a revelator of the grain boundary-type dependent behavior. (C) 2016 Elsevier Ltd. All rights reserved.
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
keyword
0.1 M NAOH, ANODIC-OXIDATION, INITIAL-STAGES, INTERGRANULAR CORROSION, CRYSTALLOGRAPHIC ORIENTATION, ALKALINE-SOLUTIONS, POLYCRYSTALLINE, COPPER, RAMAN-SPECTROSCOPY, AQUEOUS-SOLUTIONS, SURFACE-STRUCTURE, Copper, AFM, Intergranular corrosion, Passive films
journal title
CORROSION SCIENCE
Corrosion Sci.
volume
111
pages
8 pages
publisher
Pergamon-elsevier Science Ltd
place of publication
Oxford
Web of Science type
Article
Web of Science id
000382794000060
JCR category
METALLURGY & METALLURGICAL ENGINEERING
JCR impact factor
5.245 (2016)
JCR rank
2/74 (2016)
JCR quartile
1 (2016)
ISSN
0010-938X
1879-0496
DOI
10.1016/j.corsci.2016.04.013
language
English
UGent publication?
yes
classification
A1
id
8537202
handle
http://hdl.handle.net/1854/LU-8537202
date created
2017-11-13 13:34:22
date last changed
2018-04-26 07:49:26
@article{8537202,
  abstract     = {Passivation at grain boundaries was investigated on copper with Electrochemical Scanning Tunneling Microscopy. The depth in intergranular regions was measured and its variation was discussed in terms of dissolution or passive film formation. The Cu(I) passive film is found to be thicker at grain boundaries than on grains but with a similar stoichiometry. A thicker Cu(l) passive film is observed at random grain boundaries than at coherent twins. No metal is preferentially consumed at grain boundaries by transient dissolution during Cu(I) passivation. Comprehensive comparison with Cu(I)/Cu(II) passivation shows that transient dissolution is a revelator of the grain boundary-type dependent behavior. (C) 2016 Elsevier Ltd. All rights reserved.},
  author       = {Chen, Hui and Bettayeb, Mohamed and Maurice, Vincent and Klein, Lorena H. and Lapeire, Linsey and Verbeken, Kim and Terryn, Herman and Marcus, Philippe},
  issn         = {0010-938X},
  journal      = {CORROSION SCIENCE},
  keyword      = {0.1 M NAOH,ANODIC-OXIDATION,INITIAL-STAGES,INTERGRANULAR CORROSION,CRYSTALLOGRAPHIC ORIENTATION,ALKALINE-SOLUTIONS,POLYCRYSTALLINE,COPPER,RAMAN-SPECTROSCOPY,AQUEOUS-SOLUTIONS,SURFACE-STRUCTURE,Copper,AFM,Intergranular corrosion,Passive films},
  language     = {eng},
  pages        = {659--666},
  publisher    = {Pergamon-elsevier Science Ltd},
  title        = {Local passivation of metals at grain boundaries : in situ scanning tunneling microscopy study on copper},
  url          = {http://dx.doi.org/10.1016/j.corsci.2016.04.013},
  volume       = {111},
  year         = {2016},
}

Chicago
Chen, Hui, Mohamed Bettayeb, Vincent Maurice, Lorena H. Klein, Linsey Lapeire, Kim Verbeken, Herman Terryn, and Philippe Marcus. 2016. “Local Passivation of Metals at Grain Boundaries : in Situ Scanning Tunneling Microscopy Study on Copper.” Corrosion Science 111: 659–666.
APA
Chen, Hui, Bettayeb, M., Maurice, V., Klein, L. H., Lapeire, L., Verbeken, K., Terryn, H., et al. (2016). Local passivation of metals at grain boundaries : in situ scanning tunneling microscopy study on copper. CORROSION SCIENCE, 111, 659–666.
Vancouver
1.
Chen H, Bettayeb M, Maurice V, Klein LH, Lapeire L, Verbeken K, et al. Local passivation of metals at grain boundaries : in situ scanning tunneling microscopy study on copper. CORROSION SCIENCE. Oxford: Pergamon-elsevier Science Ltd; 2016;111:659–66.
MLA
Chen, Hui, Mohamed Bettayeb, Vincent Maurice, et al. “Local Passivation of Metals at Grain Boundaries : in Situ Scanning Tunneling Microscopy Study on Copper.” CORROSION SCIENCE 111 (2016): 659–666. Print.