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A Markerless 3D Tracking Approach for Augmented Reality Applications

Michiel Vlaminck UGent, Hiep Luong UGent and Wilfried Philips UGent (2017) IEEE International Conference on 3D Immersion (IC3D).
Please use this url to cite or link to this publication:
author
organization
year
type
conference (other)
publication status
in press
in
IEEE International Conference on 3D Immersion (IC3D)
pages
7 pages
publisher
IEEE
place of publication
Brussels
conference name
IEEE International Conference on 3D Immersion (IC3D)
conference organizer
IEEE
conference location
Brussels
conference start
2017-12-11
conference end
2017-12-12
language
English
UGent publication?
yes
classification
C1
id
8536063
handle
http://hdl.handle.net/1854/LU-8536063
date created
2017-11-01 09:29:23
date last changed
2017-11-06 08:24:47
@inproceedings{8536063,
  author       = {Vlaminck, Michiel and Luong, Hiep and Philips, Wilfried},
  booktitle    = {IEEE International Conference on 3D Immersion (IC3D)},
  language     = {eng},
  location     = {Brussels},
  pages        = {7},
  publisher    = {IEEE},
  title        = {A Markerless 3D Tracking Approach for Augmented Reality Applications},
  year         = {2017},
}

Chicago
Vlaminck, Michiel, Hiep Luong, and Wilfried Philips. 2017. “A Markerless 3D Tracking Approach for Augmented Reality Applications.” In IEEE International Conference on 3D Immersion (IC3D). Brussels: IEEE.
APA
Vlaminck, M., Luong, H., & Philips, W. (2017). A Markerless 3D Tracking Approach for Augmented Reality Applications. IEEE International Conference on 3D Immersion (IC3D). Presented at the IEEE International Conference on 3D Immersion (IC3D), Brussels: IEEE.
Vancouver
1.
Vlaminck M, Luong H, Philips W. A Markerless 3D Tracking Approach for Augmented Reality Applications. IEEE International Conference on 3D Immersion (IC3D). Brussels: IEEE; 2017.
MLA
Vlaminck, Michiel, Hiep Luong, and Wilfried Philips. “A Markerless 3D Tracking Approach for Augmented Reality Applications.” IEEE International Conference on 3D Immersion (IC3D). Brussels: IEEE, 2017. Print.