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Circuit modeling of the ISO 10605 field coupled electrostatic discharge test to design robust

Niels Lambrecht UGent, Daniël De Zutter UGent, Dries Vande Ginste UGent and H. Pues (2017) p.141-145
Please use this url to cite or link to this publication:
author
organization
year
type
conference (other)
publication status
published
keyword
IBCN
pages
141 - 145
conference name
EMCCompo2017, the 11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
conference location
St.-Petersburg, Russia
conference start
2017-07-04
conference end
2017-07-08
ISBN
978-1-5386-2689-4
language
English
UGent publication?
yes
classification
C1
id
8534391
handle
http://hdl.handle.net/1854/LU-8534391
date created
2017-10-16 09:23:22
date last changed
2018-05-15 12:32:03
@inproceedings{8534391,
  author       = {Lambrecht, Niels and De Zutter, Dani{\"e}l and Vande Ginste, Dries and Pues, H. },
  isbn         = {978-1-5386-2689-4},
  keyword      = {IBCN},
  language     = {eng},
  location     = {St.-Petersburg, Russia},
  pages        = {141--145},
  title        = {Circuit modeling of the ISO 10605 field coupled electrostatic discharge test to design robust},
  year         = {2017},
}

Chicago
Lambrecht, Niels, Daniël De Zutter, Dries Vande Ginste, and H. Pues. 2017. “Circuit Modeling of the ISO 10605 Field Coupled Electrostatic Discharge Test to Design Robust.” In , 141–145.
APA
Lambrecht, N., De Zutter, D., Vande Ginste, D., & Pues, H. (2017). Circuit modeling of the ISO 10605 field coupled electrostatic discharge test to design robust (pp. 141–145). Presented at the EMCCompo2017, the 11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits.
Vancouver
1.
Lambrecht N, De Zutter D, Vande Ginste D, Pues H. Circuit modeling of the ISO 10605 field coupled electrostatic discharge test to design robust. 2017. p. 141–5.
MLA
Lambrecht, Niels, Daniël De Zutter, Dries Vande Ginste, et al. “Circuit Modeling of the ISO 10605 Field Coupled Electrostatic Discharge Test to Design Robust.” 2017. 141–145. Print.