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Reliability Study of Reference Semiconductor Encapsulation Materials for Biocompatible Packaging

Karl Malachowski, Karen Qian, Maaike Op de Beeck UGent, Rita Verbeeck, George Bryce, Harold Dekkers and Deniz S. Tezcan (2012) 2012(1).
Please use this url to cite or link to this publication:
author
organization
year
type
conference (meetingAbstract)
publication status
published
volume
2012
issue
1
publisher
International Microelectronics and Packaging Society (IMAPS)
conference name
IMAPS 45th International Symposium on Microelectronics
conference organizer
IMAPS
conference location
San Diego, USA
conference start
2012-09-09
conference end
2012-09-13
ISSN
2380-4505
DOI
10.4071/isom-2012-ta51
UGent publication?
yes
classification
C3
id
8530898
handle
http://hdl.handle.net/1854/LU-8530898
date created
2017-09-11 16:02:21
date last changed
2017-09-14 07:10:38
@inproceedings{8530898,
  author       = {Malachowski, Karl and Qian, Karen and Op de Beeck, Maaike and Verbeeck, Rita and Bryce, George and Dekkers, Harold and Tezcan, Deniz S.},
  issn         = {2380-4505},
  location     = {San Diego, USA},
  number       = {1},
  publisher    = {International Microelectronics and Packaging Society (IMAPS)},
  title        = {Reliability Study of Reference Semiconductor Encapsulation Materials for Biocompatible Packaging},
  url          = {http://dx.doi.org/10.4071/isom-2012-ta51},
  volume       = {2012},
  year         = {2012},
}

Chicago
Malachowski, Karl, Karen Qian, Maaike Op de Beeck, Rita Verbeeck, George Bryce, Harold Dekkers, and Deniz S. Tezcan. 2012. “Reliability Study of Reference Semiconductor Encapsulation Materials for Biocompatible Packaging.” In Vol. 2012. International Microelectronics and Packaging Society (IMAPS).
APA
Malachowski, K., Qian, K., Op de Beeck, M., Verbeeck, R., Bryce, G., Dekkers, H., & Tezcan, D. S. (2012). Reliability Study of Reference Semiconductor Encapsulation Materials for Biocompatible Packaging (Vol. 2012). Presented at the IMAPS 45th International Symposium on Microelectronics, International Microelectronics and Packaging Society (IMAPS).
Vancouver
1.
Malachowski K, Qian K, Op de Beeck M, Verbeeck R, Bryce G, Dekkers H, et al. Reliability Study of Reference Semiconductor Encapsulation Materials for Biocompatible Packaging. International Microelectronics and Packaging Society (IMAPS); 2012.
MLA
Malachowski, Karl, Karen Qian, Maaike Op de Beeck, et al. “Reliability Study of Reference Semiconductor Encapsulation Materials for Biocompatible Packaging.” Vol. 2012. International Microelectronics and Packaging Society (IMAPS), 2012. Print.