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Reliability Study of Reference Semiconductor Encapsulation Materials for Biocompatible Packaging

(2012) 2012(1).
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Chicago
Malachowski, Karl, Karen Qian, Maaike Op de Beeck, Rita Verbeeck, George Bryce, Harold Dekkers, and Deniz S. Tezcan. 2012. “Reliability Study of Reference Semiconductor Encapsulation Materials for Biocompatible Packaging.” In Vol. 2012. International Microelectronics and Packaging Society (IMAPS).
APA
Malachowski, K., Qian, K., Op de Beeck, M., Verbeeck, R., Bryce, G., Dekkers, H., & Tezcan, D. S. (2012). Reliability Study of Reference Semiconductor Encapsulation Materials for Biocompatible Packaging (Vol. 2012). Presented at the IMAPS 45th International Symposium on Microelectronics, International Microelectronics and Packaging Society (IMAPS).
Vancouver
1.
Malachowski K, Qian K, Op de Beeck M, Verbeeck R, Bryce G, Dekkers H, et al. Reliability Study of Reference Semiconductor Encapsulation Materials for Biocompatible Packaging. International Microelectronics and Packaging Society (IMAPS); 2012.
MLA
Malachowski, Karl, Karen Qian, Maaike Op de Beeck, et al. “Reliability Study of Reference Semiconductor Encapsulation Materials for Biocompatible Packaging.” Vol. 2012. International Microelectronics and Packaging Society (IMAPS), 2012. Print.
@inproceedings{8530898,
  author       = {Malachowski, Karl and Qian, Karen and Op de Beeck, Maaike and Verbeeck, Rita and Bryce, George and Dekkers, Harold and Tezcan, Deniz S.},
  issn         = {2380-4505},
  location     = {San Diego, USA},
  number       = {1},
  publisher    = {International Microelectronics and Packaging Society (IMAPS)},
  title        = {Reliability Study of Reference Semiconductor Encapsulation Materials for Biocompatible Packaging},
  url          = {http://dx.doi.org/10.4071/isom-2012-ta51},
  volume       = {2012},
  year         = {2012},
}

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