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Electrochemical fabrication of platinum interconnects for implantable electronic devices

(2014) MICROELECTRONIC ENGINEERING. 120. p.251-256
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Abstract
In this paper we report on fabrication of Platinum (Pt) interconnects on the flexible bio-compatible substrates, having in mind possible applications in implantable medical devices. We aim to replace physical vapor deposition methods (PVD) with plating in cases when this is cost effective, i.e. when only a small fraction of the substrate needs to be coated with Pt. We optimize plating parameters by doing tests on coupons, and then explore up-scaling the process to 2 inch wafers and larger substrates/carriers covered with releasable polyimide layers. Physical and chemical properties of deposited lines are assessed, and post-plating steps developed so that characteristics of electrochemically deposited (ECD) Pt match those of PVD Pt. (C) 2013 Elsevier B.V. All rights reserved.
Keywords
ELECTRODEPOSITION, NUCLEATION, FILMS, Platinum, Plating, Interconnects, Flexible, Implantable, Devices

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Chicago
Radisic, A., B. M. Morcos, Maaike Op de Beeck, J. M. O’Callaghan, and C. Van Hoof. 2014. “Electrochemical Fabrication of Platinum Interconnects for Implantable Electronic Devices.” Microelectronic Engineering 120: 251–256.
APA
Radisic, A., Morcos, B. M., Op de Beeck, M., O’Callaghan, J. M., & Van Hoof, C. (2014). Electrochemical fabrication of platinum interconnects for implantable electronic devices. MICROELECTRONIC ENGINEERING, 120, 251–256.
Vancouver
1.
Radisic A, Morcos BM, Op de Beeck M, O’Callaghan JM, Van Hoof C. Electrochemical fabrication of platinum interconnects for implantable electronic devices. MICROELECTRONIC ENGINEERING. Amsterdam: Elsevier Science Bv; 2014;120:251–6.
MLA
Radisic, A., B. M. Morcos, Maaike Op de Beeck, et al. “Electrochemical Fabrication of Platinum Interconnects for Implantable Electronic Devices.” MICROELECTRONIC ENGINEERING 120 (2014): 251–256. Print.
@article{8530654,
  abstract     = {In this paper we report on fabrication of Platinum (Pt) interconnects on the flexible bio-compatible substrates, having in mind possible applications in implantable medical devices. We aim to replace physical vapor deposition methods (PVD) with plating in cases when this is cost effective, i.e. when only a small fraction of the substrate needs to be coated with Pt. We optimize plating parameters by doing tests on coupons, and then explore up-scaling the process to 2 inch wafers and larger substrates/carriers covered with releasable polyimide layers. Physical and chemical properties of deposited lines are assessed, and post-plating steps developed so that characteristics of electrochemically deposited (ECD) Pt match those of PVD Pt. (C) 2013 Elsevier B.V. All rights reserved.},
  author       = {Radisic, A. and Morcos, B. M. and Op de Beeck, Maaike and O'Callaghan, J. M. and Van Hoof, C.},
  issn         = {0167-9317},
  journal      = {MICROELECTRONIC ENGINEERING},
  language     = {eng},
  pages        = {251--256},
  publisher    = {Elsevier Science Bv},
  title        = {Electrochemical fabrication of platinum interconnects for implantable electronic devices},
  url          = {http://dx.doi.org/10.1016/j.mee.2013.07.004},
  volume       = {120},
  year         = {2014},
}

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