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Reliability analysis for power devices which undego fast thermal cycling

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MLA
Simon, D., et al. “Reliability Analysis for Power Devices Which Undego Fast Thermal Cycling.” IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, vol. 16, 2016, pp. 336–44.
APA
Simon, D., De Mey, G., Topa, V., & Spitzer, G. (2016). Reliability analysis for power devices which undego fast thermal cycling. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 16, 336–344.
Chicago author-date
Simon, D, Gilbert De Mey, V Topa, and G Spitzer. 2016. “Reliability Analysis for Power Devices Which Undego Fast Thermal Cycling.” IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 16: 336–44.
Chicago author-date (all authors)
Simon, D, Gilbert De Mey, V Topa, and G Spitzer. 2016. “Reliability Analysis for Power Devices Which Undego Fast Thermal Cycling.” IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 16: 336–344.
Vancouver
1.
Simon D, De Mey G, Topa V, Spitzer G. Reliability analysis for power devices which undego fast thermal cycling. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY. 2016;16:336–44.
IEEE
[1]
D. Simon, G. De Mey, V. Topa, and G. Spitzer, “Reliability analysis for power devices which undego fast thermal cycling,” IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, vol. 16, pp. 336–344, 2016.
@article{8514575,
  author       = {{Simon, D and De Mey, Gilbert and Topa, V and Spitzer, G}},
  issn         = {{1530-4388}},
  journal      = {{IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY}},
  language     = {{eng}},
  pages        = {{336--344}},
  title        = {{Reliability analysis for power devices which undego fast thermal cycling}},
  volume       = {{16}},
  year         = {{2016}},
}