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Influence of grain size on the electrochemical behavior of pure copper

Linsey Lapeire UGent, E Martinez Lombardia, Iris De Graeve UGent, H Terryn and Kim Verbeken UGent (2017) JOURNAL OF MATERIALS SCIENCE . 52(3). p.1501-1510
abstract
Despite numerous research works a thorough understanding on how grain size influences the electrochemical behavior of metals is still lacking due to the inability to decouple grain size effects from other microstructural characteristics. In this work, the combination of potentiodynamic polarization measurements and the gold-nanoplating technique was used on high purity copper to further explore this relationship. The high purity copper was thermomechanically processed in such a way that three samples were produced with markedly different average grain sizes, namely 1.4, 48 and 191 A mu m. All other parameters influencing the electrochemical behavior, such as internal stresses and texture were kept constant; microstructural characterization was performed by electron backscatter diffraction. In 0.1 M HCl, the anodic polarization curves demonstrate that for the smaller the grain size a lower corrosion potential and higher corrosion current density is observed. The gold-nanoplating experiments show that the material with the smallest grain size is corroding more uniformly than the samples with the larger grain sizes. In the sample with the medium grain size, the higher electrochemical activity of the grain boundaries is demonstrated. In the largest grain size sample, both the grain boundaries as well as some of the grain interiors are covered with gold.
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
keyword
CORROSION BEHAVIOR, POLYCRYSTALLINE COPPER, NANOCRYSTALLINE, ORIENTATION, ALLOY, MICROSTRUCTURE, DEPOSITION, BOUNDARIES, GROWTH, STEEL
journal title
JOURNAL OF MATERIALS SCIENCE
volume
52
issue
3
pages
1501 - 1510
publisher
Springer Nature
Web of Science type
Article
Web of Science id
000389409000025
ISSN
0022-2461
1573-4803
DOI
10.1007/s10853-016-0445-z
language
English
UGent publication?
yes
classification
A1
id
8506916
handle
http://hdl.handle.net/1854/LU-8506916
date created
2017-02-02 10:46:59
date last changed
2017-12-04 09:59:50
@article{8506916,
  abstract     = {Despite numerous research works a thorough understanding on how grain size influences the electrochemical behavior of metals is still lacking due to the inability to decouple grain size effects from other microstructural characteristics. In this work, the combination of potentiodynamic polarization measurements and the gold-nanoplating technique was used on high purity copper to further explore this relationship. The high purity copper was thermomechanically processed in such a way that three samples were produced with markedly different average grain sizes, namely 1.4, 48 and 191 A mu m. All other parameters influencing the electrochemical behavior, such as internal stresses and texture were kept constant; microstructural characterization was performed by electron backscatter diffraction. In 0.1 M HCl, the anodic polarization curves demonstrate that for the smaller the grain size a lower corrosion potential and higher corrosion current density is observed. The gold-nanoplating experiments show that the material with the smallest grain size is corroding more uniformly than the samples with the larger grain sizes. In the sample with the medium grain size, the higher electrochemical activity of the grain boundaries is demonstrated. In the largest grain size sample, both the grain boundaries as well as some of the grain interiors are covered with gold.},
  author       = {Lapeire, Linsey and Martinez Lombardia, E and De Graeve, Iris and Terryn, H and Verbeken, Kim},
  issn         = {0022-2461},
  journal      = {JOURNAL OF MATERIALS SCIENCE },
  keyword      = {CORROSION BEHAVIOR,POLYCRYSTALLINE COPPER,NANOCRYSTALLINE,ORIENTATION,ALLOY,MICROSTRUCTURE,DEPOSITION,BOUNDARIES,GROWTH,STEEL},
  language     = {eng},
  number       = {3},
  pages        = {1501--1510},
  publisher    = {Springer Nature},
  title        = {Influence of grain size on the electrochemical behavior of pure copper},
  url          = {http://dx.doi.org/10.1007/s10853-016-0445-z},
  volume       = {52},
  year         = {2017},
}

Chicago
Lapeire, Linsey, E Martinez Lombardia, Iris De Graeve, H Terryn, and Kim Verbeken. 2017. “Influence of Grain Size on the Electrochemical Behavior of Pure Copper.” Journal of Materials Science 52 (3): 1501–1510.
APA
Lapeire, Linsey, Martinez Lombardia, E., De Graeve, I., Terryn, H., & Verbeken, K. (2017). Influence of grain size on the electrochemical behavior of pure copper. JOURNAL OF MATERIALS SCIENCE , 52(3), 1501–1510.
Vancouver
1.
Lapeire L, Martinez Lombardia E, De Graeve I, Terryn H, Verbeken K. Influence of grain size on the electrochemical behavior of pure copper. JOURNAL OF MATERIALS SCIENCE . Springer Nature; 2017;52(3):1501–10.
MLA
Lapeire, Linsey, E Martinez Lombardia, Iris De Graeve, et al. “Influence of Grain Size on the Electrochemical Behavior of Pure Copper.” JOURNAL OF MATERIALS SCIENCE 52.3 (2017): 1501–1510. Print.