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MMSE equalization of multi-Gb/s chip-to-chip interconnects with M-PAM signaling affected by manufacturing tolerances

Jelle Bailleul (UGent) , Lennert Jacobs (UGent) , Paolo Manfredi (UGent) , Dries Vande Ginste (UGent) and Marc Moeneclaey (UGent)
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Keywords
Chip-to-chip communication, MMSE equalization, manufacturing tolerances

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MLA
Bailleul, Jelle, et al. “MMSE Equalization of Multi-Gb/s Chip-to-Chip Interconnects with M-PAM Signaling Affected by Manufacturing Tolerances.” 2016 IEEE SYMPOSIUM ON COMMUNICATIONS AND VEHICULAR TECHNOLOGY IN THE BENELUX (SCVT), Institute of Electrical and Electronics Engineers (IEEE), 2016, pp. 1–6, doi:10.1109/scvt.2016.7797658.
APA
Bailleul, J., Jacobs, L., Manfredi, P., Vande Ginste, D., & Moeneclaey, M. (2016). MMSE equalization of multi-Gb/s chip-to-chip interconnects with M-PAM signaling affected by manufacturing tolerances. 2016 IEEE SYMPOSIUM ON COMMUNICATIONS AND VEHICULAR TECHNOLOGY IN THE BENELUX (SCVT), 1–6. https://doi.org/10.1109/scvt.2016.7797658
Chicago author-date
Bailleul, Jelle, Lennert Jacobs, Paolo Manfredi, Dries Vande Ginste, and Marc Moeneclaey. 2016. “MMSE Equalization of Multi-Gb/s Chip-to-Chip Interconnects with M-PAM Signaling Affected by Manufacturing Tolerances.” In 2016 IEEE SYMPOSIUM ON COMMUNICATIONS AND VEHICULAR TECHNOLOGY IN THE BENELUX (SCVT), 1–6. Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/scvt.2016.7797658.
Chicago author-date (all authors)
Bailleul, Jelle, Lennert Jacobs, Paolo Manfredi, Dries Vande Ginste, and Marc Moeneclaey. 2016. “MMSE Equalization of Multi-Gb/s Chip-to-Chip Interconnects with M-PAM Signaling Affected by Manufacturing Tolerances.” In 2016 IEEE SYMPOSIUM ON COMMUNICATIONS AND VEHICULAR TECHNOLOGY IN THE BENELUX (SCVT), 1–6. Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/scvt.2016.7797658.
Vancouver
1.
Bailleul J, Jacobs L, Manfredi P, Vande Ginste D, Moeneclaey M. MMSE equalization of multi-Gb/s chip-to-chip interconnects with M-PAM signaling affected by manufacturing tolerances. In: 2016 IEEE SYMPOSIUM ON COMMUNICATIONS AND VEHICULAR TECHNOLOGY IN THE BENELUX (SCVT). Institute of Electrical and Electronics Engineers (IEEE); 2016. p. 1–6.
IEEE
[1]
J. Bailleul, L. Jacobs, P. Manfredi, D. Vande Ginste, and M. Moeneclaey, “MMSE equalization of multi-Gb/s chip-to-chip interconnects with M-PAM signaling affected by manufacturing tolerances,” in 2016 IEEE SYMPOSIUM ON COMMUNICATIONS AND VEHICULAR TECHNOLOGY IN THE BENELUX (SCVT), Mons, Belgium, 2016, pp. 1–6.
@inproceedings{8506873,
  author       = {{Bailleul, Jelle and Jacobs, Lennert and Manfredi, Paolo and Vande Ginste, Dries and Moeneclaey, Marc}},
  booktitle    = {{2016 IEEE SYMPOSIUM ON COMMUNICATIONS AND VEHICULAR TECHNOLOGY IN THE BENELUX (SCVT)}},
  isbn         = {{9781509043613}},
  issn         = {{2373-0854}},
  keywords     = {{Chip-to-chip communication,MMSE equalization,manufacturing tolerances}},
  language     = {{eng}},
  location     = {{Mons, Belgium}},
  pages        = {{1--6}},
  publisher    = {{Institute of Electrical and Electronics Engineers (IEEE)}},
  title        = {{MMSE equalization of multi-Gb/s chip-to-chip interconnects with M-PAM signaling affected by manufacturing tolerances}},
  url          = {{http://dx.doi.org/10.1109/scvt.2016.7797658}},
  year         = {{2016}},
}

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