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Ultra thin chip packaging (UTCP): a promising technology for future flexible display interconnection

Jonathan Govaerts (UGent) , Wim Christiaens (UGent) and Jan Vanfleteren (UGent)
Author
Organization
Abstract
With several flexible display technologies sprouting up, the driving electronics seem to become the limiting factors in the bendability of any flexible display system. The idea of adapting existing interconnection technologies is discussed. Finally, ultrathin chip packaging is proposed to bypass this limitation imposed by the rigidity of the driver electronics.

Citation

Please use this url to cite or link to this publication:

MLA
Govaerts, Jonathan, Wim Christiaens, and Jan Vanfleteren. “Ultra Thin Chip Packaging (UTCP): a Promising Technology for Future Flexible Display Interconnection.” 2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III. Ed. J Morreale. Campbell, CA, USA: Society for Information Display (SID), 2009. 202–205. Print.
APA
Govaerts, J., Christiaens, W., & Vanfleteren, J. (2009). Ultra thin chip packaging (UTCP): a promising technology for future flexible display interconnection. In J. Morreale (Ed.), 2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III (pp. 202–205). Presented at the 47th Annual Symposium of the Society-for-Information-Display (SID 2009), Campbell, CA, USA: Society for Information Display (SID).
Chicago author-date
Govaerts, Jonathan, Wim Christiaens, and Jan Vanfleteren. 2009. “Ultra Thin Chip Packaging (UTCP): a Promising Technology for Future Flexible Display Interconnection.” In 2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III, ed. J Morreale, 202–205. Campbell, CA, USA: Society for Information Display (SID).
Chicago author-date (all authors)
Govaerts, Jonathan, Wim Christiaens, and Jan Vanfleteren. 2009. “Ultra Thin Chip Packaging (UTCP): a Promising Technology for Future Flexible Display Interconnection.” In 2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III, ed. J Morreale, 202–205. Campbell, CA, USA: Society for Information Display (SID).
Vancouver
1.
Govaerts J, Christiaens W, Vanfleteren J. Ultra thin chip packaging (UTCP): a promising technology for future flexible display interconnection. In: Morreale J, editor. 2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III. Campbell, CA, USA: Society for Information Display (SID); 2009. p. 202–5.
IEEE
[1]
J. Govaerts, W. Christiaens, and J. Vanfleteren, “Ultra thin chip packaging (UTCP): a promising technology for future flexible display interconnection,” in 2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III, San Antonio, TX, USA, 2009, pp. 202–205.
@inproceedings{826671,
  abstract     = {With several flexible display technologies sprouting up, the driving electronics seem to become the limiting factors in the bendability of any flexible display system. The idea of adapting existing interconnection technologies is discussed. Finally, ultrathin chip packaging is proposed to bypass this limitation imposed by the rigidity of the driver electronics.},
  author       = {Govaerts, Jonathan and Christiaens, Wim and Vanfleteren, Jan},
  booktitle    = {2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III},
  editor       = {Morreale, J},
  language     = {eng},
  location     = {San Antonio, TX, USA},
  pages        = {202--205},
  publisher    = {Society for Information Display (SID)},
  title        = {Ultra thin chip packaging (UTCP): a promising technology for future flexible display interconnection},
  year         = {2009},
}

Web of Science
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