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Flexible polyimide based ultra-thin chip package (UTCP)

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Chicago
Christiaens, Wim, Erwin Bosman, Wim Huwel, Wim Perdu, and Jan Vanfleteren. 2007. “Flexible Polyimide Based Ultra-thin Chip Package (UTCP).” In Flexible and Stretchable Electronics, 1st International Workshop, Abstracts.
APA
Christiaens, Wim, Bosman, E., Huwel, W., Perdu, W., & Vanfleteren, J. (2007). Flexible polyimide based ultra-thin chip package (UTCP). Flexible and Stretchable Electronics, 1st International workshop, Abstracts. Presented at the 1st International workshop on Flexible and Stretchable Electronics (FlexStretch Workshop 2007).
Vancouver
1.
Christiaens W, Bosman E, Huwel W, Perdu W, Vanfleteren J. Flexible polyimide based ultra-thin chip package (UTCP). Flexible and Stretchable Electronics, 1st International workshop, Abstracts. 2007.
MLA
Christiaens, Wim, Erwin Bosman, Wim Huwel, et al. “Flexible Polyimide Based Ultra-thin Chip Package (UTCP).” Flexible and Stretchable Electronics, 1st International Workshop, Abstracts. 2007. Print.
@inproceedings{826631,
  author       = {Christiaens, Wim and Bosman, Erwin and Huwel, Wim and Perdu, Wim and Vanfleteren, Jan},
  booktitle    = {Flexible and Stretchable Electronics, 1st International workshop, Abstracts},
  language     = {eng},
  location     = {Leuven, Belgium},
  title        = {Flexible polyimide based ultra-thin chip package (UTCP)},
  year         = {2007},
}