Advanced search

UTCP: 60 µm thick bendable package

Author
Organization

Citation

Please use this url to cite or link to this publication:

Chicago
Christiaens, Wim, Bart Vandevelde, Erwin Bosman, and Jan Vanfleteren. 2006. “UTCP: 60 Μm Thick Bendable Package.” In International Wafer-Level Packaging Conference, 3rd, Proceedings, 114–119.
APA
Christiaens, Wim, Vandevelde, B., Bosman, E., & Vanfleteren, J. (2006). UTCP: 60 µm thick bendable package. International Wafer-Level Packaging Conference, 3rd, Proceedings (pp. 114–119). Presented at the 3rd International Wafer-Level Packaging Conference (IWLPC 2006).
Vancouver
1.
Christiaens W, Vandevelde B, Bosman E, Vanfleteren J. UTCP: 60 µm thick bendable package. International Wafer-Level Packaging Conference, 3rd, Proceedings. 2006. p. 114–9.
MLA
Christiaens, Wim, Bart Vandevelde, Erwin Bosman, et al. “UTCP: 60 Μm Thick Bendable Package.” International Wafer-Level Packaging Conference, 3rd, Proceedings. 2006. 114–119. Print.
@inproceedings{826577,
  author       = {Christiaens, Wim and Vandevelde, Bart and Bosman, Erwin and Vanfleteren, Jan},
  booktitle    = {International Wafer-Level Packaging Conference, 3rd, Proceedings},
  language     = {eng},
  location     = {San Jos{\'e}, CA, USA},
  pages        = {114--119},
  title        = {UTCP: 60 {\textmu}m thick bendable package},
  year         = {2006},
}