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The influence of the surface preparation on the electrodeposition of gold particles on silicon

Katia De Henau UGent, Inge Huygens and Katrien Strubbe UGent (2010) JOURNAL OF SOLID STATE ELECTROCHEMISTRY. 14(1). p.83-91
abstract
In a systematical study of the electrodeposition of gold (I) on silicon (100), the influence of the surface preparation on the nucleation behavior of gold was investigated. A two-phase experimental design was used. In the first phase, it was investigated whether there is an influence; in the second phase, an optimization was performed. It was found that more homogeneous particle coverages and higher particle densities can be obtained when the surface is dipped in an acid fluoride solution with small nitric acid to hydrogen fluoride proportions. Furthermore, the observations indicated that more negative deposition potentials also lead to better coverages, higher densities, and less clustering
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
keyword
MECHANISM, LIQUID-SOLID GROWTH, SYSTEM, DEPOSITION, NANOWIRES, ELECTROCHEMICAL NUCLEATION, AQUEOUS HF SOLUTIONS, particles, nucleation, electrochemical deposition, surface preparation, electrodeposition, silicon, gold
journal title
JOURNAL OF SOLID STATE ELECTROCHEMISTRY
J. Solid State Electrochem.
volume
14
issue
1
pages
83 - 91
Web of Science type
Article
Web of Science id
000271107600011
JCR category
ELECTROCHEMISTRY
JCR impact factor
2.234 (2010)
JCR rank
13/26 (2010)
JCR quartile
3 (2010)
ISSN
1432-8488
DOI
10.1007/s10008-009-0789-2
language
English
UGent publication?
yes
classification
A1
copyright statement
I have transferred the copyright for this publication to the publisher
id
817218
handle
http://hdl.handle.net/1854/LU-817218
date created
2010-01-04 10:26:49
date last changed
2018-01-29 12:12:56
@article{817218,
  abstract     = {In a systematical study of the electrodeposition of gold (I) on silicon (100), the influence of the surface preparation on the nucleation behavior of gold was investigated. A two-phase experimental design was used. In the first phase, it was investigated whether there is an influence; in the second phase, an optimization was performed. It was found that more homogeneous particle coverages and higher particle densities can be obtained when the surface is dipped in an acid fluoride solution with small nitric acid to hydrogen fluoride proportions. Furthermore, the observations indicated that more negative deposition potentials also lead to better coverages, higher densities, and less clustering},
  author       = {De Henau, Katia and Huygens, Inge and Strubbe, Katrien},
  issn         = {1432-8488},
  journal      = {JOURNAL OF SOLID STATE ELECTROCHEMISTRY},
  keyword      = {MECHANISM,LIQUID-SOLID GROWTH,SYSTEM,DEPOSITION,NANOWIRES,ELECTROCHEMICAL NUCLEATION,AQUEOUS HF SOLUTIONS,particles,nucleation,electrochemical deposition,surface preparation,electrodeposition,silicon,gold},
  language     = {eng},
  number       = {1},
  pages        = {83--91},
  title        = {The influence of the surface preparation on the electrodeposition of gold particles on silicon},
  url          = {http://dx.doi.org/10.1007/s10008-009-0789-2},
  volume       = {14},
  year         = {2010},
}

Chicago
De Henau, Katia, Inge Huygens, and Katrien Strubbe. 2010. “The Influence of the Surface Preparation on the Electrodeposition of Gold Particles on Silicon.” Journal of Solid State Electrochemistry 14 (1): 83–91.
APA
De Henau, K., Huygens, I., & Strubbe, K. (2010). The influence of the surface preparation on the electrodeposition of gold particles on silicon. JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 14(1), 83–91.
Vancouver
1.
De Henau K, Huygens I, Strubbe K. The influence of the surface preparation on the electrodeposition of gold particles on silicon. JOURNAL OF SOLID STATE ELECTROCHEMISTRY. 2010;14(1):83–91.
MLA
De Henau, Katia, Inge Huygens, and Katrien Strubbe. “The Influence of the Surface Preparation on the Electrodeposition of Gold Particles on Silicon.” JOURNAL OF SOLID STATE ELECTROCHEMISTRY 14.1 (2010): 83–91. Print.