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Large-area compatible fabrication and encapsulation of inkjet-printed humidity sensors on flexible foils with integrated thermal compensation

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Abstract
This work presents the simultaneous fabrication of ambient relative humidity (RH) and temperature sensors arrays, inkjet-printed on flexible substrates and subsequently encapsulated at foil level. These sensors are based on planar interdigitated capacitors with an inkjet-printed sensing layer and meander-shaped resistors. Their combination allows the compensation of the RH signals variations at different temperatures. The whole fabrication of the system is carried out at foil level and involves the utilization of additive methods such as inkjet-printing and electrodeposition. Electrodeposition of the printed lines resulted in an improvement of the thermoresistors. The sensors have been characterized and their performances analyzed. The encapsulation layer does not modify the performances of the sensors in terms of sensitivity or response time. This work demonstrates the potential of inkjet-printing in the large-area fabrication of light-weight and cost-efficient gas sensors on flexible substrates.
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Chicago
Molina-Lopez, F, Andrés Felipe Vasquez Quintero, G Mattana, D Briand, and NF de Rooij. 2013. “Large-area Compatible Fabrication and Encapsulation of Inkjet-printed Humidity Sensors on Flexible Foils with Integrated Thermal Compensation.” Journal of Micromechanics and Microengineering 23 (2).
APA
Molina-Lopez, F., Vasquez Quintero, A. F., Mattana, G., Briand, D., & de Rooij, N. (2013). Large-area compatible fabrication and encapsulation of inkjet-printed humidity sensors on flexible foils with integrated thermal compensation. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 23(2).
Vancouver
1.
Molina-Lopez F, Vasquez Quintero AF, Mattana G, Briand D, de Rooij N. Large-area compatible fabrication and encapsulation of inkjet-printed humidity sensors on flexible foils with integrated thermal compensation. JOURNAL OF MICROMECHANICS AND MICROENGINEERING. BRISTOL: IOP PUBLISHING LTD; 2013;23(2).
MLA
Molina-Lopez, F, Andrés Felipe Vasquez Quintero, G Mattana, et al. “Large-area Compatible Fabrication and Encapsulation of Inkjet-printed Humidity Sensors on Flexible Foils with Integrated Thermal Compensation.” JOURNAL OF MICROMECHANICS AND MICROENGINEERING 23.2 (2013): n. pag. Print.
@article{8162766,
  abstract     = {This work presents the simultaneous fabrication of ambient relative humidity (RH) and temperature sensors arrays, inkjet-printed on flexible substrates and subsequently encapsulated at foil level. These sensors are based on planar interdigitated capacitors with an inkjet-printed sensing layer and meander-shaped resistors. Their combination allows the compensation of the RH signals variations at different temperatures. The whole fabrication of the system is carried out at foil level and involves the utilization of additive methods such as inkjet-printing and electrodeposition. Electrodeposition of the printed lines resulted in an improvement of the thermoresistors. The sensors have been characterized and their performances analyzed. The encapsulation layer does not modify the performances of the sensors in terms of sensitivity or response time. This work demonstrates the potential of inkjet-printing in the large-area fabrication of light-weight and cost-efficient gas sensors on flexible substrates.},
  articleno    = {025012},
  author       = {Molina-Lopez, F and Vasquez Quintero, Andr{\'e}s Felipe and Mattana, G and Briand, D and de Rooij, NF},
  issn         = {0960-1317},
  journal      = {JOURNAL OF MICROMECHANICS AND MICROENGINEERING},
  language     = {eng},
  number       = {2},
  pages        = {11},
  publisher    = {IOP PUBLISHING LTD},
  title        = {Large-area compatible fabrication and encapsulation of inkjet-printed humidity sensors on flexible foils with integrated thermal compensation},
  url          = {http://dx.doi.org/10.1088/0960-1317/23/2/025012},
  volume       = {23},
  year         = {2013},
}

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