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How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance

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MLA
Vandevelde, Bart, Lieven Degrendele, Maarten Cauwe, et al. “How the Mold Compound Thermal Expansion Overrules the Solder Composition Choice in Board Level Reliability Performance.” International Conference on Electronics Packaging. IEEE, 2016. 94–98. Print.
APA
Vandevelde, Bart, Degrendele, L., Cauwe, M., Allaert, B., Lauwaert, R., & Willems, G. (2016). How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance. International Conference on Electronics Packaging (pp. 94–98). Presented at the International Conference on Electronics Packaging (ICEP), IEEE.
Chicago author-date
Vandevelde, Bart, Lieven Degrendele, Maarten Cauwe, Bart Allaert, Ralf Lauwaert, and Geert Willems. 2016. “How the Mold Compound Thermal Expansion Overrules the Solder Composition Choice in Board Level Reliability Performance.” In International Conference on Electronics Packaging, 94–98. IEEE.
Chicago author-date (all authors)
Vandevelde, Bart, Lieven Degrendele, Maarten Cauwe, Bart Allaert, Ralf Lauwaert, and Geert Willems. 2016. “How the Mold Compound Thermal Expansion Overrules the Solder Composition Choice in Board Level Reliability Performance.” In International Conference on Electronics Packaging, 94–98. IEEE.
Vancouver
1.
Vandevelde B, Degrendele L, Cauwe M, Allaert B, Lauwaert R, Willems G. How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance. International Conference on Electronics Packaging. IEEE; 2016. p. 94–8.
IEEE
[1]
B. Vandevelde, L. Degrendele, M. Cauwe, B. Allaert, R. Lauwaert, and G. Willems, “How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance,” in International Conference on Electronics Packaging, Sapporo, Japan, 2016, pp. 94–98.
@inproceedings{8030634,
  author       = {Vandevelde, Bart and Degrendele, Lieven and Cauwe, Maarten and Allaert, Bart and Lauwaert, Ralf and Willems, Geert},
  booktitle    = {International Conference on Electronics Packaging},
  language     = {eng},
  location     = {Sapporo, Japan},
  pages        = {94--98},
  publisher    = {IEEE},
  title        = {How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance},
  year         = {2016},
}