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Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors

Joris Van Campenhout, Pietro RA Binetti, Pedro Rojo Romeo, Philippe Regreny, Christian Seassal, Xaveer JM Leijtens, Tjibbe de Vries, Yoki Siang Oei, Rene PJ van Veldhoven, Richard Notzel, et al. (2009) IEEE PHOTONICS TECHNOLOGY LETTERS. 21(8). p.522-524
abstract
We present a proof-of-principle demonstration of a low-footprint optical interconnect on a silicon-on-insulator (SOI) chip. The optical link consists of a heterogeneously integrated, InP-based microdisk laser (MDL) and microdetector, coupled to a common SOI wire waveguide. Applying an electrical current to the MDL resulted in a detector current up to 1 mu A.
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
keyword
microdisk laser (MDL), Heterogeneous integration, optical interconnect, silicon photonics, WAVE-GUIDE CIRCUIT
journal title
IEEE PHOTONICS TECHNOLOGY LETTERS
IEEE Photonics Technol. Lett.
volume
21
issue
8
pages
3 pages
Web of Science type
Article
Web of Science id
000266054900010
JCR category
ENGINEERING, ELECTRICAL & ELECTRONIC
JCR impact factor
1.815 (2009)
JCR rank
56/244 (2009)
JCR quartile
1 (2009)
ISSN
1041-1135
DOI
10.1109/LPT.2009.2014391
language
English
UGent publication?
yes
classification
A1
copyright statement
I have transferred the copyright for this publication to the publisher
id
784147
handle
http://hdl.handle.net/1854/LU-784147
date created
2009-11-18 21:57:50
date last changed
2016-12-19 15:42:45
@article{784147,
  abstract     = {We present a proof-of-principle demonstration of a low-footprint optical interconnect on a silicon-on-insulator (SOI) chip. The optical link consists of a heterogeneously integrated, InP-based microdisk laser (MDL) and microdetector, coupled to a common SOI wire waveguide. Applying an electrical current to the MDL resulted in a detector current up to 1 mu A.},
  author       = {Van Campenhout, Joris and Binetti, Pietro RA and Romeo, Pedro Rojo and Regreny, Philippe and Seassal, Christian and Leijtens, Xaveer JM and de Vries, Tjibbe and Oei, Yoki Siang and van Veldhoven, Rene PJ and Notzel, Richard and Di Cioccio, Lea and Fedeli, Jean-Marc and Smit, Meint K and Van Thourhout, Dries and Baets, Roel},
  issn         = {1041-1135},
  journal      = {IEEE PHOTONICS TECHNOLOGY LETTERS},
  keyword      = {microdisk laser (MDL),Heterogeneous integration,optical interconnect,silicon photonics,WAVE-GUIDE CIRCUIT},
  language     = {eng},
  number       = {8},
  pages        = {522--524},
  title        = {Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors},
  url          = {http://dx.doi.org/10.1109/LPT.2009.2014391},
  volume       = {21},
  year         = {2009},
}

Chicago
Van Campenhout, Joris, Pietro RA Binetti, Pedro Rojo Romeo, Philippe Regreny, Christian Seassal, Xaveer JM Leijtens, Tjibbe de Vries, et al. 2009. “Low-footprint Optical Interconnect on an SOI Chip Through Heterogeneous Integration of InP-based Microdisk Lasers and Microdetectors.” Ieee Photonics Technology Letters 21 (8): 522–524.
APA
Van Campenhout, Joris, Binetti, P. R., Romeo, P. R., Regreny, P., Seassal, C., Leijtens, X. J., de Vries, T., et al. (2009). Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors. IEEE PHOTONICS TECHNOLOGY LETTERS, 21(8), 522–524.
Vancouver
1.
Van Campenhout J, Binetti PR, Romeo PR, Regreny P, Seassal C, Leijtens XJ, et al. Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors. IEEE PHOTONICS TECHNOLOGY LETTERS. 2009;21(8):522–4.
MLA
Van Campenhout, Joris, Pietro RA Binetti, Pedro Rojo Romeo, et al. “Low-footprint Optical Interconnect on an SOI Chip Through Heterogeneous Integration of InP-based Microdisk Lasers and Microdetectors.” IEEE PHOTONICS TECHNOLOGY LETTERS 21.8 (2009): 522–524. Print.