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Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors

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Abstract
We present a proof-of-principle demonstration of a low-footprint optical interconnect on a silicon-on-insulator (SOI) chip. The optical link consists of a heterogeneously integrated, InP-based microdisk laser (MDL) and microdetector, coupled to a common SOI wire waveguide. Applying an electrical current to the MDL resulted in a detector current up to 1 mu A.
Keywords
microdisk laser (MDL), Heterogeneous integration, optical interconnect, silicon photonics, WAVE-GUIDE CIRCUIT

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Chicago
Van Campenhout, Joris, Pietro RA Binetti, Pedro Rojo Romeo, Philippe Regreny, Christian Seassal, Xaveer JM Leijtens, Tjibbe de Vries, et al. 2009. “Low-footprint Optical Interconnect on an SOI Chip Through Heterogeneous Integration of InP-based Microdisk Lasers and Microdetectors.” Ieee Photonics Technology Letters 21 (8): 522–524.
APA
Van Campenhout, Joris, Binetti, P. R., Romeo, P. R., Regreny, P., Seassal, C., Leijtens, X. J., de Vries, T., et al. (2009). Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors. IEEE PHOTONICS TECHNOLOGY LETTERS, 21(8), 522–524.
Vancouver
1.
Van Campenhout J, Binetti PR, Romeo PR, Regreny P, Seassal C, Leijtens XJ, et al. Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors. IEEE PHOTONICS TECHNOLOGY LETTERS. 2009;21(8):522–4.
MLA
Van Campenhout, Joris, Pietro RA Binetti, Pedro Rojo Romeo, et al. “Low-footprint Optical Interconnect on an SOI Chip Through Heterogeneous Integration of InP-based Microdisk Lasers and Microdetectors.” IEEE PHOTONICS TECHNOLOGY LETTERS 21.8 (2009): 522–524. Print.
@article{784147,
  abstract     = {We present a proof-of-principle demonstration of a low-footprint optical interconnect on a silicon-on-insulator (SOI) chip. The optical link consists of a heterogeneously integrated, InP-based microdisk laser (MDL) and microdetector, coupled to a common SOI wire waveguide. Applying an electrical current to the MDL resulted in a detector current up to 1 mu A.},
  author       = {Van Campenhout, Joris and Binetti, Pietro RA and Romeo, Pedro Rojo and Regreny, Philippe and Seassal, Christian and Leijtens, Xaveer JM and de Vries, Tjibbe and Oei, Yoki Siang and van Veldhoven, Rene PJ and Notzel, Richard and Di Cioccio, Lea and Fedeli, Jean-Marc and Smit, Meint K and Van Thourhout, Dries and Baets, Roel},
  issn         = {1041-1135},
  journal      = {IEEE PHOTONICS TECHNOLOGY LETTERS},
  keyword      = {microdisk laser (MDL),Heterogeneous integration,optical interconnect,silicon photonics,WAVE-GUIDE CIRCUIT},
  language     = {eng},
  number       = {8},
  pages        = {522--524},
  title        = {Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors},
  url          = {http://dx.doi.org/10.1109/LPT.2009.2014391},
  volume       = {21},
  year         = {2009},
}

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