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Chimney effect on natural convection cooling of a transistor mounted on a cooling fin

Author
Organization
Abstract
The thermal impedance Z(th)(j omega) has been measured for the junction of a transistor mounted on a cooling fin. The setup was put inside a chimney in order to enhance the natural convection cooling. From the thermal impedance Z(th)(j omega) the influence of the chimney on the reduction in thermal resistance R-th=Z(th)(j omega=0) is clearly visible. A maximum improvement of almost 20% has been observed experimentally. Measuring the thermal impedance as a function of the angular frequency omega provides specific information about the thermal path being influenced by the chimney.
Keywords
cooling, thermal management (packaging), natural convection, semiconductor device packaging, thermal conductivity, transistors, thermal resistance

Citation

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MLA
De Mey, Gilbert, et al. “Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin.” JOURNAL OF ELECTRONIC PACKAGING, vol. 131, no. 1, 2009, doi:10.1115/1.3068307.
APA
De Mey, G., Wojcik, M., Pilarski, J., Lasota, M., Banaszczyk, J., Vermeersch, B., … De Paepe, M. (2009). Chimney effect on natural convection cooling of a transistor mounted on a cooling fin. JOURNAL OF ELECTRONIC PACKAGING, 131(1). https://doi.org/10.1115/1.3068307
Chicago author-date
De Mey, Gilbert, M Wojcik, J Pilarski, M Lasota, J Banaszczyk, Bjorn Vermeersch, A Napieralski, and Michel De Paepe. 2009. “Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin.” JOURNAL OF ELECTRONIC PACKAGING 131 (1). https://doi.org/10.1115/1.3068307.
Chicago author-date (all authors)
De Mey, Gilbert, M Wojcik, J Pilarski, M Lasota, J Banaszczyk, Bjorn Vermeersch, A Napieralski, and Michel De Paepe. 2009. “Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin.” JOURNAL OF ELECTRONIC PACKAGING 131 (1). doi:10.1115/1.3068307.
Vancouver
1.
De Mey G, Wojcik M, Pilarski J, Lasota M, Banaszczyk J, Vermeersch B, et al. Chimney effect on natural convection cooling of a transistor mounted on a cooling fin. JOURNAL OF ELECTRONIC PACKAGING. 2009;131(1).
IEEE
[1]
G. De Mey et al., “Chimney effect on natural convection cooling of a transistor mounted on a cooling fin,” JOURNAL OF ELECTRONIC PACKAGING, vol. 131, no. 1, 2009.
@article{727017,
  abstract     = {{The thermal impedance Z(th)(j omega) has been measured for the junction of a transistor mounted on a cooling fin. The setup was put inside a chimney in order to enhance the natural convection cooling. From the thermal impedance Z(th)(j omega) the influence of the chimney on the reduction in thermal resistance R-th=Z(th)(j omega=0) is clearly visible. A maximum improvement of almost 20% has been observed experimentally. Measuring the thermal impedance as a function of the angular frequency omega provides specific information about the thermal path being influenced by the chimney.}},
  articleno    = {{014501}},
  author       = {{De Mey, Gilbert and Wojcik, M and Pilarski, J and Lasota, M and Banaszczyk, J and Vermeersch, Bjorn and Napieralski, A and De Paepe, Michel}},
  issn         = {{1043-7398}},
  journal      = {{JOURNAL OF ELECTRONIC PACKAGING}},
  keywords     = {{cooling,thermal management (packaging),natural convection,semiconductor device packaging,thermal conductivity,transistors,thermal resistance}},
  language     = {{eng}},
  number       = {{1}},
  pages        = {{3}},
  title        = {{Chimney effect on natural convection cooling of a transistor mounted on a cooling fin}},
  url          = {{http://doi.org/10.1115/1.3068307}},
  volume       = {{131}},
  year         = {{2009}},
}

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