Chimney effect on natural convection cooling of a transistor mounted on a cooling fin
- Author
- Gilbert De Mey (UGent) , M Wojcik, J Pilarski, M Lasota, J Banaszczyk, Bjorn Vermeersch (UGent) , A Napieralski and Michel De Paepe (UGent)
- Organization
- Abstract
- The thermal impedance Z(th)(j omega) has been measured for the junction of a transistor mounted on a cooling fin. The setup was put inside a chimney in order to enhance the natural convection cooling. From the thermal impedance Z(th)(j omega) the influence of the chimney on the reduction in thermal resistance R-th=Z(th)(j omega=0) is clearly visible. A maximum improvement of almost 20% has been observed experimentally. Measuring the thermal impedance as a function of the angular frequency omega provides specific information about the thermal path being influenced by the chimney.
- Keywords
- cooling, thermal management (packaging), natural convection, semiconductor device packaging, thermal conductivity, transistors, thermal resistance
Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-727017
- MLA
- De Mey, Gilbert, et al. “Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin.” JOURNAL OF ELECTRONIC PACKAGING, vol. 131, no. 1, 2009, doi:10.1115/1.3068307.
- APA
- De Mey, G., Wojcik, M., Pilarski, J., Lasota, M., Banaszczyk, J., Vermeersch, B., … De Paepe, M. (2009). Chimney effect on natural convection cooling of a transistor mounted on a cooling fin. JOURNAL OF ELECTRONIC PACKAGING, 131(1). https://doi.org/10.1115/1.3068307
- Chicago author-date
- De Mey, Gilbert, M Wojcik, J Pilarski, M Lasota, J Banaszczyk, Bjorn Vermeersch, A Napieralski, and Michel De Paepe. 2009. “Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin.” JOURNAL OF ELECTRONIC PACKAGING 131 (1). https://doi.org/10.1115/1.3068307.
- Chicago author-date (all authors)
- De Mey, Gilbert, M Wojcik, J Pilarski, M Lasota, J Banaszczyk, Bjorn Vermeersch, A Napieralski, and Michel De Paepe. 2009. “Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin.” JOURNAL OF ELECTRONIC PACKAGING 131 (1). doi:10.1115/1.3068307.
- Vancouver
- 1.De Mey G, Wojcik M, Pilarski J, Lasota M, Banaszczyk J, Vermeersch B, et al. Chimney effect on natural convection cooling of a transistor mounted on a cooling fin. JOURNAL OF ELECTRONIC PACKAGING. 2009;131(1).
- IEEE
- [1]G. De Mey et al., “Chimney effect on natural convection cooling of a transistor mounted on a cooling fin,” JOURNAL OF ELECTRONIC PACKAGING, vol. 131, no. 1, 2009.
@article{727017,
abstract = {{The thermal impedance Z(th)(j omega) has been measured for the junction of a transistor mounted on a cooling fin. The setup was put inside a chimney in order to enhance the natural convection cooling. From the thermal impedance Z(th)(j omega) the influence of the chimney on the reduction in thermal resistance R-th=Z(th)(j omega=0) is clearly visible. A maximum improvement of almost 20% has been observed experimentally. Measuring the thermal impedance as a function of the angular frequency omega provides specific information about the thermal path being influenced by the chimney.}},
articleno = {{014501}},
author = {{De Mey, Gilbert and Wojcik, M and Pilarski, J and Lasota, M and Banaszczyk, J and Vermeersch, Bjorn and Napieralski, A and De Paepe, Michel}},
issn = {{1043-7398}},
journal = {{JOURNAL OF ELECTRONIC PACKAGING}},
keywords = {{cooling,thermal management (packaging),natural convection,semiconductor device packaging,thermal conductivity,transistors,thermal resistance}},
language = {{eng}},
number = {{1}},
pages = {{3}},
title = {{Chimney effect on natural convection cooling of a transistor mounted on a cooling fin}},
url = {{http://doi.org/10.1115/1.3068307}},
volume = {{131}},
year = {{2009}},
}
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