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Arbitrarily shaped 2.5D circuits using stretchable interconnections and embedding in thermoplastic polymers

Jan Vanfleteren (UGent) , Imen Chtioui, Bart Plovie (UGent) , Yang Yang (UGent) , Frederick Bossuyt (UGent) , Thomas Vervust (UGent) , Sheila Dunphy (UGent) and Bjorn Vandecasteele (UGent)
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Keywords
TECHNOLOGY, Stretchable circuits, thermoplastic circuits, 2.5D, 3D, thermoforming, smart objects

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MLA
Vanfleteren, Jan, et al. “Arbitrarily Shaped 2.5D Circuits Using Stretchable Interconnections and Embedding in Thermoplastic Polymers.” Procedia Technology, vol. 15, ELSEVIER SCIENCE BV, 2014, pp. 208–15, doi:10.1016/j.protcy.2014.09.073.
APA
Vanfleteren, J., Chtioui, I., Plovie, B., Yang, Y., Bossuyt, F., Vervust, T., … Vandecasteele, B. (2014). Arbitrarily shaped 2.5D circuits using stretchable interconnections and embedding in thermoplastic polymers. Procedia Technology, 15, 208–215. https://doi.org/10.1016/j.protcy.2014.09.073
Chicago author-date
Vanfleteren, Jan, Imen Chtioui, Bart Plovie, Yang Yang, Frederick Bossuyt, Thomas Vervust, Sheila Dunphy, and Bjorn Vandecasteele. 2014. “Arbitrarily Shaped 2.5D Circuits Using Stretchable Interconnections and Embedding in Thermoplastic Polymers.” In Procedia Technology, 15:208–15. AMSTERDAM: ELSEVIER SCIENCE BV. https://doi.org/10.1016/j.protcy.2014.09.073.
Chicago author-date (all authors)
Vanfleteren, Jan, Imen Chtioui, Bart Plovie, Yang Yang, Frederick Bossuyt, Thomas Vervust, Sheila Dunphy, and Bjorn Vandecasteele. 2014. “Arbitrarily Shaped 2.5D Circuits Using Stretchable Interconnections and Embedding in Thermoplastic Polymers.” In Procedia Technology, 15:208–215. AMSTERDAM: ELSEVIER SCIENCE BV. doi:10.1016/j.protcy.2014.09.073.
Vancouver
1.
Vanfleteren J, Chtioui I, Plovie B, Yang Y, Bossuyt F, Vervust T, et al. Arbitrarily shaped 2.5D circuits using stretchable interconnections and embedding in thermoplastic polymers. In: Procedia Technology. AMSTERDAM: ELSEVIER SCIENCE BV; 2014. p. 208–15.
IEEE
[1]
J. Vanfleteren et al., “Arbitrarily shaped 2.5D circuits using stretchable interconnections and embedding in thermoplastic polymers,” in Procedia Technology, Univ Bremen, Bremen, GERMANY, 2014, vol. 15, pp. 208–215.
@inproceedings{7244868,
  author       = {{Vanfleteren, Jan and Chtioui, Imen and Plovie, Bart and Yang, Yang and Bossuyt, Frederick and Vervust, Thomas and Dunphy, Sheila and Vandecasteele, Bjorn}},
  booktitle    = {{Procedia Technology}},
  issn         = {{2212-0173}},
  keywords     = {{TECHNOLOGY,Stretchable circuits,thermoplastic circuits,2.5D,3D,thermoforming,smart objects}},
  language     = {{eng}},
  location     = {{Univ Bremen, Bremen, GERMANY}},
  pages        = {{208--215}},
  publisher    = {{ELSEVIER SCIENCE BV}},
  title        = {{Arbitrarily shaped 2.5D circuits using stretchable interconnections and embedding in thermoplastic polymers}},
  url          = {{http://doi.org/10.1016/j.protcy.2014.09.073}},
  volume       = {{15}},
  year         = {{2014}},
}

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