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Flip-chip integration of tilted VCSELs onto a silicon photonic integrated circuit

(2016) OPTICS EXPRESS. 24(15). p.16258-16266
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Abstract
In this article we describe a cost-effective approach for hybrid laser integration, in which vertical cavity surface emitting lasers (VCSELs) are passively-aligned and flip-chip bonded to a Si photonic integrated circuit (PIC), with a tilt-angle optimized for optical-insertion into standard grating-couplers. A tilt-angle of 10 degrees is achieved by controlling the reflow of the solder ball deposition used for the electrical-contacting and mechanical-bonding of the VCSEL to the PIC. After flip-chip integration, the VCSEL-to-PIC insertion loss is -11.8 dB, indicating an excess coupling penalty of -5.9 dB, compared to Fibre-to-PIC coupling. Finite difference time domain simulations indicate that the penalty arises from the relatively poor match between the VCSEL mode and the grating-coupler. (C) 2016 Optical Society of America
Keywords
GRATING COUPLERS, SI, LASER

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MLA
Lu, Huihui, et al. “Flip-Chip Integration of Tilted VCSELs onto a Silicon Photonic Integrated Circuit.” OPTICS EXPRESS, vol. 24, no. 15, 2016, pp. 16258–66, doi:10.1364/OE.24.016258.
APA
Lu, H., Lee, J. S., Scarcella, C., Zhao, Y., Cardile, P., Daly, A., … O’Brien, P. (2016). Flip-chip integration of tilted VCSELs onto a silicon photonic integrated circuit. OPTICS EXPRESS, 24(15), 16258–16266. https://doi.org/10.1364/OE.24.016258
Chicago author-date
Lu, Huihui, Jun Su Lee, Carmelo Scarcella, Yan Zhao, Paolo Cardile, Aidan Daly, Markus Ortsiefer, Lee Carroll, and Peter O’Brien. 2016. “Flip-Chip Integration of Tilted VCSELs onto a Silicon Photonic Integrated Circuit.” OPTICS EXPRESS 24 (15): 16258–66. https://doi.org/10.1364/OE.24.016258.
Chicago author-date (all authors)
Lu, Huihui, Jun Su Lee, Carmelo Scarcella, Yan Zhao, Paolo Cardile, Aidan Daly, Markus Ortsiefer, Lee Carroll, and Peter O’Brien. 2016. “Flip-Chip Integration of Tilted VCSELs onto a Silicon Photonic Integrated Circuit.” OPTICS EXPRESS 24 (15): 16258–16266. doi:10.1364/OE.24.016258.
Vancouver
1.
Lu H, Lee JS, Scarcella C, Zhao Y, Cardile P, Daly A, et al. Flip-chip integration of tilted VCSELs onto a silicon photonic integrated circuit. OPTICS EXPRESS. 2016;24(15):16258–66.
IEEE
[1]
H. Lu et al., “Flip-chip integration of tilted VCSELs onto a silicon photonic integrated circuit,” OPTICS EXPRESS, vol. 24, no. 15, pp. 16258–16266, 2016.
@article{7239630,
  abstract     = {{In this article we describe a cost-effective approach for hybrid laser integration, in which vertical cavity surface emitting lasers (VCSELs) are passively-aligned and flip-chip bonded to a Si photonic integrated circuit (PIC), with a tilt-angle optimized for optical-insertion into standard grating-couplers. A tilt-angle of 10 degrees is achieved by controlling the reflow of the solder ball deposition used for the electrical-contacting and mechanical-bonding of the VCSEL to the PIC. After flip-chip integration, the VCSEL-to-PIC insertion loss is -11.8 dB, indicating an excess coupling penalty of -5.9 dB, compared to Fibre-to-PIC coupling. Finite difference time domain simulations indicate that the penalty arises from the relatively poor match between the VCSEL mode and the grating-coupler. (C) 2016 Optical Society of America}},
  author       = {{Lu, Huihui and Lee, Jun Su and Scarcella, Carmelo and Zhao, Yan and Cardile, Paolo and Daly, Aidan and Ortsiefer, Markus and Carroll, Lee and O'Brien, Peter}},
  issn         = {{1094-4087}},
  journal      = {{OPTICS EXPRESS}},
  keywords     = {{GRATING COUPLERS,SI,LASER}},
  language     = {{eng}},
  number       = {{15}},
  pages        = {{16258--16266}},
  title        = {{Flip-chip integration of tilted VCSELs onto a silicon photonic integrated circuit}},
  url          = {{http://dx.doi.org/10.1364/OE.24.016258}},
  volume       = {{24}},
  year         = {{2016}},
}

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