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Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Extending the capabilities of the silicon photonic platform

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Project
Center for nano- and biophotonics (NB-Photonics)
Abstract
Limitations of silicon photonics can be overcome by hybrid integration or by photonic multi-chip systems. We give an overview on recent progress regarding silicon-organic hybrid (SOH) integration as well as multi-chip integration enabled by photonic wire bonding.
Keywords
photonic wire bonding, multi-chip integration, optical interconnects, HIGH-SPEED, MODULATORS, Silicon photonics, silicon-organic hybrid (SOH) integration, plasmonic-organic hybrid (POH) integration

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Citation

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Chicago
Koos, C, W Freude, J Leuthold, M Kohl, LR Dalton, Wim Bogaerts, M Lauermann, et al. 2015. “Silicon-organic Hybrid (SOH) Integration and Photonic Multi-chip Systems: Extending the Capabilities of the Silicon Photonic Platform.” In IEEE Photonics Conference.
APA
Koos, C., Freude, W., Leuthold, J., Kohl, M., Dalton, L., Bogaerts, W., Lauermann, M., et al. (2015). Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Extending the capabilities of the silicon photonic platform. IEEE Photonics Conference. Presented at the IEEE Photonics Conference.
Vancouver
1.
Koos C, Freude W, Leuthold J, Kohl M, Dalton L, Bogaerts W, et al. Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Extending the capabilities of the silicon photonic platform. IEEE Photonics Conference. 2015.
MLA
Koos, C et al. “Silicon-organic Hybrid (SOH) Integration and Photonic Multi-chip Systems: Extending the Capabilities of the Silicon Photonic Platform.” IEEE Photonics Conference. 2015. Print.
@inproceedings{7195827,
  abstract     = {Limitations of silicon photonics can be overcome by hybrid integration or by photonic multi-chip systems. We give an overview on recent progress regarding silicon-organic hybrid (SOH) integration as well as multi-chip integration enabled by photonic wire bonding.},
  author       = {Koos, C and Freude, W and Leuthold, J and Kohl, M and Dalton, LR and Bogaerts, Wim and Lauermann, M and Wolf, S and Weimann, C and Melikyan, A and Lindenmann, N and Billah, MR and Muehlbrandt, S and Koeber, S and Palmer, R and Koehnle, K and Alloatti, L and Elder, DL and Giesecke, A-L and Wahlbrink, T},
  booktitle    = {IEEE Photonics Conference},
  isbn         = {978-1-4799-7465-8},
  issn         = {2374-0140},
  keywords     = {photonic wire bonding,multi-chip integration,optical interconnects,HIGH-SPEED,MODULATORS,Silicon photonics,silicon-organic hybrid (SOH) integration,plasmonic-organic hybrid (POH) integration},
  language     = {eng},
  location     = {Reston, VA},
  title        = {Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Extending the capabilities of the silicon photonic platform},
  year         = {2015},
}

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