Ghent University Academic Bibliography

Advanced

On the target surface cleanness during magnetron sputtering

Roeland Schelfhout UGent and Diederik Depla UGent (2015) Reactive Sputter Deposition, 14th International symposium, Abstracts.
abstract
The magnetron sputter deposition of metallic thin films usually requires high vacuum sputtering conditions to avoid the contamination of impurities on the substrate. The presence of these impurities highly influence the thin film texture and microstructure. The impurities in the ambient gas not only directly affect the substrate condition, they will also adsorb onto the target surface. As they get sputtered, they will be directed towards the substrate with energies much higher than the thermal ambient gas particles, which has a huge impact on the thin film characteristics. In this way, the target surface cleanness can play an essential role for thin film growth. To quantify the target cleanness, the compound formation on a tantalum target was studied by poisoning the target as a function of the oxygen exposure and subsequently sputter cleaning the formed compound layer in pure argon. The discharge voltage during this sputter cleaning stage contains a lot of information from which the compound layer thickness can be deduced. By studying the compound formation rate, the target surface cleanness during different sputtering conditions can be estimated
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
keyword
Sputtering, chemisorption, magnetron, modelling
in
Reactive Sputter Deposition, 14th International symposium, Abstracts
conference name
14th International symposium on Reactive Sputter Deposition
conference location
Paris, France
conference start
2015-12-08
conference end
2015-12-11
language
English
UGent publication?
yes
classification
C3
id
7191664
handle
http://hdl.handle.net/1854/LU-7191664
date created
2016-04-22 09:21:32
date last changed
2016-12-19 15:37:07
@inproceedings{7191664,
  abstract     = {The magnetron sputter deposition of metallic thin films usually requires high vacuum sputtering conditions to avoid the contamination of impurities on the substrate. The presence of these impurities highly influence the thin film texture and microstructure. The impurities in the ambient gas not only directly affect the substrate condition, they will also adsorb onto the target surface.  As they get sputtered, they will be directed towards the substrate with energies much higher than the thermal ambient gas particles, which has a huge impact on the thin film characteristics. In this way, the target surface cleanness can play an essential role for thin film growth.
To quantify the target cleanness, the compound formation on a tantalum target was studied by poisoning the target as a function of the oxygen exposure and subsequently sputter cleaning the formed compound layer in pure argon. The discharge voltage during this sputter cleaning stage contains a lot of information from which the compound layer thickness can be deduced. By studying the compound formation rate, the target surface cleanness during different sputtering conditions can be estimated},
  author       = {Schelfhout, Roeland and Depla, Diederik},
  booktitle    = {Reactive Sputter Deposition, 14th International symposium, Abstracts},
  keyword      = {Sputtering,chemisorption,magnetron,modelling},
  language     = {eng},
  location     = {Paris, France},
  title        = {On the target surface cleanness during magnetron sputtering},
  year         = {2015},
}

Chicago
Schelfhout, Roeland, and Diederik Depla. 2015. β€œOn the Target Surface Cleanness During Magnetron Sputtering.” In Reactive Sputter Deposition, 14th International Symposium, Abstracts.
APA
Schelfhout, R., & Depla, D. (2015). On the target surface cleanness during magnetron sputtering. Reactive Sputter Deposition, 14th International symposium, Abstracts. Presented at the 14th International symposium on Reactive Sputter Deposition.
Vancouver
1.
Schelfhout R, Depla D. On the target surface cleanness during magnetron sputtering. Reactive Sputter Deposition, 14th International symposium, Abstracts. 2015.
MLA
Schelfhout, Roeland, and Diederik Depla. β€œOn the Target Surface Cleanness During Magnetron Sputtering.” Reactive Sputter Deposition, 14th International Symposium, Abstracts. 2015. Print.