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UV cure, HF stability, Oxycarbosilane, Low-k

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Citation

Please use this url to cite or link to this publication:

Chicago
Redzheb, Murad, Lutz Prager, Mikhail Krishtab, Silvia Armini, Kris Vanstreels, Alexis Franquet, Pascal Van Der Voort, and Mikhail R Baklanov. 2016. “UV Cure of Oxycarbosilane Low-k Films.” Microelectronic Engineering 156: 103–107.
APA
Redzheb, M., Prager, L., Krishtab, M., Armini, S., Vanstreels, K., Franquet, A., Van Der Voort, P., et al. (2016). UV cure of oxycarbosilane low-k films. MICROELECTRONIC ENGINEERING, 156, 103–107. Presented at the 24th Workshop on Materials for Advanced Metallization, held jointly with the International Interconnect Technology (IITC).
Vancouver
1.
Redzheb M, Prager L, Krishtab M, Armini S, Vanstreels K, Franquet A, et al. UV cure of oxycarbosilane low-k films. MICROELECTRONIC ENGINEERING. 2016;156:103–7.
MLA
Redzheb, Murad, Lutz Prager, Mikhail Krishtab, et al. “UV Cure of Oxycarbosilane Low-k Films.” MICROELECTRONIC ENGINEERING 156 (2016): 103–107. Print.
@article{7151259,
  author       = {Redzheb, Murad and Prager, Lutz and Krishtab, Mikhail and Armini, Silvia and Vanstreels, Kris and Franquet, Alexis and Van Der Voort, Pascal and Baklanov, Mikhail R},
  issn         = {0167-9317},
  journal      = {MICROELECTRONIC ENGINEERING},
  language     = {eng},
  location     = {Grenoble, France},
  pages        = {103--107},
  title        = {UV cure of oxycarbosilane low-k films},
  url          = {http://dx.doi.org/10.1016/j.mee.2016.02.001},
  volume       = {156},
  year         = {2016},
}

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