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Can reversible electronics avoid thermal problems?

Alexis De Vos UGent (2009) International Conference on Microtechnology and Thermal Problems in Electronics, 8th, Proceedings. p.1-7
abstract
Conventional logic gates (e.g. AND gates) cannot be used for building a reversible computer. An appropriate design approach is necessary. Both small building blocks and a more complex circuit in MOS technology are presented. These promise to avoid thermal problems in digital electronics.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
keyword
MOS technology, thermal problem, reversible computer
in
International Conference on Microtechnology and Thermal Problems in Electronics, 8th, Proceedings
editor
Zbigniew Lisik
pages
7 pages
publisher
Technical University Lodz
place of publication
Lodz
conference name
8th International Conference on Microtechnology and Thermal Problems in Electronics
conference location
Lodz, Poland
conference start
2009-06-28
conference end
2009-07-01
language
English
UGent publication?
yes
classification
C1
id
712737
handle
http://hdl.handle.net/1854/LU-712737
date created
2009-07-02 11:52:52
date last changed
2009-07-07 15:24:42
@inproceedings{712737,
  abstract     = {Conventional logic gates (e.g. AND  gates) cannot be used for building a reversible computer. An appropriate design approach is necessary. Both small building blocks and a more complex circuit in MOS technology are presented. These promise to avoid thermal problems in digital electronics.},
  author       = {De Vos, Alexis},
  booktitle    = {International Conference on Microtechnology and Thermal Problems in Electronics, 8th, Proceedings},
  editor       = {Lisik, Zbigniew},
  keyword      = {MOS technology,thermal problem,reversible computer},
  language     = {eng},
  location     = {Lodz, Poland},
  pages        = {1--7},
  publisher    = {Technical University Lodz},
  title        = {Can reversible electronics avoid thermal problems?},
  year         = {2009},
}

Chicago
De Vos, Alexis. 2009. “Can Reversible Electronics Avoid Thermal Problems?” In International Conference on Microtechnology and Thermal Problems in Electronics, 8th, Proceedings, ed. Zbigniew Lisik, 1–7. Lodz: Technical University Lodz.
APA
De Vos, Alexis. (2009). Can reversible electronics avoid thermal problems? In Z. Lisik (Ed.), International Conference on Microtechnology and Thermal Problems in Electronics, 8th, Proceedings (pp. 1–7). Presented at the 8th International Conference on Microtechnology and Thermal Problems in Electronics, Lodz: Technical University Lodz.
Vancouver
1.
De Vos A. Can reversible electronics avoid thermal problems? In: Lisik Z, editor. International Conference on Microtechnology and Thermal Problems in Electronics, 8th, Proceedings. Lodz: Technical University Lodz; 2009. p. 1–7.
MLA
De Vos, Alexis. “Can Reversible Electronics Avoid Thermal Problems?” International Conference on Microtechnology and Thermal Problems in Electronics, 8th, Proceedings. Ed. Zbigniew Lisik. Lodz: Technical University Lodz, 2009. 1–7. Print.