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Elastic electronic circuits and systems using Moulded Interconnect Device (MID) technology

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Chicago
Vanfleteren, Jan, Fabrice Axisa, Dominique Brosteaux, Frederick Bossuyt, Eva De Leersnyder, Thomas Vervust, Benoît Huyghe, Jeroen Missinne, Rik Verplancke, and Mario Gonzalez. 2008. “Elastic Electronic Circuits and Systems Using Moulded Interconnect Device (MID) Technology.” In MRS Spring Meeting, Abstracts. Materials Research Society (MRS).
APA
Vanfleteren, Jan, Axisa, F., Brosteaux, D., Bossuyt, F., De Leersnyder, E., Vervust, T., Huyghe, B., et al. (2008). Elastic electronic circuits and systems using Moulded Interconnect Device (MID) technology. MRS Spring Meeting, Abstracts. Presented at the MRS Spring Meeting 2008 : Materials and technology for flexible, conformable and stretchable sensors and transistors, Materials Research Society (MRS).
Vancouver
1.
Vanfleteren J, Axisa F, Brosteaux D, Bossuyt F, De Leersnyder E, Vervust T, et al. Elastic electronic circuits and systems using Moulded Interconnect Device (MID) technology. MRS Spring Meeting, Abstracts. Materials Research Society (MRS); 2008.
MLA
Vanfleteren, Jan, Fabrice Axisa, Dominique Brosteaux, et al. “Elastic Electronic Circuits and Systems Using Moulded Interconnect Device (MID) Technology.” MRS Spring Meeting, Abstracts. Materials Research Society (MRS), 2008. Print.
@inproceedings{703933,
  author       = {Vanfleteren, Jan and Axisa, Fabrice and Brosteaux, Dominique and Bossuyt, Frederick and De Leersnyder, Eva and Vervust, Thomas and Huyghe, Beno{\^i}t and Missinne, Jeroen and Verplancke, Rik and Gonzalez, Mario},
  booktitle    = {MRS Spring Meeting, Abstracts},
  language     = {eng},
  location     = {San Francisco, CA, USA},
  publisher    = {Materials Research Society (MRS)},
  title        = {Elastic electronic circuits and systems using Moulded Interconnect Device (MID) technology},
  year         = {2008},
}