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Elastic electronic circuits and systems using Moulded Interconnect Device (MID) technology

Jan Vanfleteren UGent, Fabrice Axisa UGent, Dominique Brosteaux UGent, Frederick Bossuyt UGent, Eva De Leersnyder, Thomas Vervust UGent, Benoît Huyghe UGent, Jeroen Missinne UGent, Rik Verplancke UGent and Mario Gonzalez (2008) MRS Spring Meeting, Abstracts.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
in
MRS Spring Meeting, Abstracts
publisher
Materials Research Society (MRS)
conference name
MRS Spring Meeting 2008 : Materials and technology for flexible, conformable and stretchable sensors and transistors
conference location
San Francisco, CA, USA
conference start
2008-03-24
conference end
2008-03-28
language
English
UGent publication?
yes
classification
C3
additional info
invited paper
id
703933
handle
http://hdl.handle.net/1854/LU-703933
date created
2009-06-18 13:43:32
date last changed
2010-11-08 16:09:34
@inproceedings{703933,
  author       = {Vanfleteren, Jan and Axisa, Fabrice and Brosteaux, Dominique and Bossuyt, Frederick and De Leersnyder, Eva and Vervust, Thomas and Huyghe, Beno{\^i}t and Missinne, Jeroen and Verplancke, Rik and Gonzalez, Mario},
  booktitle    = {MRS Spring Meeting, Abstracts},
  language     = {eng},
  location     = {San Francisco, CA, USA},
  publisher    = {Materials Research Society (MRS)},
  title        = {Elastic electronic circuits and systems using Moulded Interconnect Device (MID) technology},
  year         = {2008},
}

Chicago
Vanfleteren, Jan, Fabrice Axisa, Dominique Brosteaux, Frederick Bossuyt, Eva De Leersnyder, Thomas Vervust, Benoît Huyghe, Jeroen Missinne, Rik Verplancke, and Mario Gonzalez. 2008. “Elastic Electronic Circuits and Systems Using Moulded Interconnect Device (MID) Technology.” In MRS Spring Meeting, Abstracts. Materials Research Society (MRS).
APA
Vanfleteren, J., Axisa, F., Brosteaux, D., Bossuyt, F., De Leersnyder, E., Vervust, T., Huyghe, B., et al. (2008). Elastic electronic circuits and systems using Moulded Interconnect Device (MID) technology. MRS Spring Meeting, Abstracts. Presented at the MRS Spring Meeting 2008 : Materials and technology for flexible, conformable and stretchable sensors and transistors, Materials Research Society (MRS).
Vancouver
1.
Vanfleteren J, Axisa F, Brosteaux D, Bossuyt F, De Leersnyder E, Vervust T, et al. Elastic electronic circuits and systems using Moulded Interconnect Device (MID) technology. MRS Spring Meeting, Abstracts. Materials Research Society (MRS); 2008.
MLA
Vanfleteren, Jan, Fabrice Axisa, Dominique Brosteaux, et al. “Elastic Electronic Circuits and Systems Using Moulded Interconnect Device (MID) Technology.” MRS Spring Meeting, Abstracts. Materials Research Society (MRS), 2008. Print.